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參數(shù)資料
| 型號： | MT54W4MH9BF-5 |
| 廠商： | Micron Technology, Inc. |
| 英文描述： | 36Mb QDR⑩II SRAM 2-WORD BURST |
| 中文描述： | ⑩分配36MB四年防務審查II SRAM的2字爆 |
| 文件頁數(shù)： | 2/27頁 |
| 文件大?。?/td> | 302K |
| 代理商： | MT54W4MH9BF-5 |
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4 MEG x 8, 4 MEG x 9, 2 MEG x 18, 1 MEG x 36
1.8V V
DD
, HSTL, QDRIIb2 SRAM
ADVANCE
36Mb: 1.8V V
DD
, HSTL, QDRIIb2 SRAM
MT54W2MH18B_A.fm - Rev 9/02
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2
2002, Micron Technology Inc.
GENERAL DESCRIPTION (continued)
Since data can be transferred into and out of the
device on every rising edge of both clocks (K and K#, C
and C#), memory bandwidth is maximized while sys-
tem design is simplified by eliminating bus turn-
arounds.
Depth expansion is accomplished with port selects
for each port (read R#, write W#), which are received at
K rising edge. Port selects permit independent port
operation.
All synchronous inputs pass through registers con-
trolled by the K or K# input clock rising edges. Active
LOW byte writes (BWx#) permit byte or nibble write
selection. Write data and byte writes are registered on
the rising edges of both K and K#. The addressing
within each burst of two is fixed and sequential, begin-
ning with the lowest and ending with the highest
address. All synchronous data outputs pass through
output registers controlled by the rising edges of the
output clocks (C and C# if provided, otherwise K and
K#).
Four balls are used to implement JTAG test capabili-
ties: test mode select (TMS), test data-in (TDI), test
clock (TCK), and test data-out (TDO). JTAG circuitry is
used to serially shift data to and from the SRAM. JTAG
inputs use JEDEC-standard 1.8V I/O levels to shift data
during this testing mode of operation.
The SRAM operates from a +1.8V power supply, and
all inputs and outputs are HSTL-compatible. The
device is ideally suited for applications that benefit
from a high-speed, fully-utilized DDR data bus.
Please refer to Micron’s Web site (
www.micron.com/
sramds
) for the latest data sheet.
READ/WRITE OPERATIONS
All bus transactions operate on an uninterruptable
burst of two data, requiring one full clock cycle of bus
utilization. The resulting benefit is that short data
transactions can remain in operation on both buses
provided that the address rate can be maintained by
the system (2x the clock frequency).
READ cycles are pipelined. The request is initiated
by asserting R# LOW at K rising edge. Data is delivered
after the rising edge of K# (t + 1) using C and C# as the
output timing references or using K and K#, if C and C#
are tied HIGH. If C and C# are tied HIGH, they may not
be toggled during device operation. Output tri-stating
is automatically controlled such that the bus is
released if no data is being delivered. This permits
banked SRAM systems with no complex OE timing
generation. Back-to-back READ cycles are initiated
every K rising edge.
Figure 2
Functional Block Diagram: 2 Meg x 18
NOTE:
1. The functional block diagram illustrates simplified device operation. See truth table, ball descriptions, and timing diagrams for
detailed information. The x8, x9, and x36 operations are the same, with apporpriate adjustments of depth and width.
2. n = 20
ADDRESS
D (Data In)
n
n
R#
W#
K
K#
18
36
36
36
K#
K
R#
W#
BW0#
BW1#
K
2 x 36
MEMORY
ARRAY
C
ADDRESS
REGISTRY
& LOGIC
DATA
REGISTRY
& LOGIC
C, C#
or
K, K#
18
Q
(Data Out)
2
CQ, CQ#
(Echo Clock Out)
R
E
G
2
W
R
I
T
E
MUX
D
R
I
V
E
R
W
R
I
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T
P
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T
相關PDF資料 |
PDF描述 |
|---|---|
| MT54W4MH9BF-6 | 36Mb QDR⑩II SRAM 2-WORD BURST |
| MT54W4MH9BF-7.5 | 36Mb QDR⑩II SRAM 2-WORD BURST |
| MT55L128L32F1 | 3.3V I/O，128K x 32，F(xiàn)low-Through ZBT SRAM(3.3V輸入/輸出,4Mb流通式同步靜態(tài)存儲器) |
| MT55L128L36F1 | 3.3V I/O，128K x 36，F(xiàn)low-Through ZBT SRAM(3.3V輸入/輸出,4Mb流通式同步靜態(tài)存儲器) |
| MT55L128V32F1 | 2.5V I/O， 128K x 32，F(xiàn)low-Through ZBT SRAM(2.5V輸入/輸出,4Mb流通式同步靜態(tài)存儲器) |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MT54W4MH9BF-6 | 制造商:MICRON 制造商全稱:Micron Technology 功能描述:36Mb QDR⑩II SRAM 2-WORD BURST |
| MT54W4MH9BF-7.5 | 制造商:MICRON 制造商全稱:Micron Technology 功能描述:36Mb QDR⑩II SRAM 2-WORD BURST |
| MT54W512H36BF-7.5 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| MT54W512H36JF-6 | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Micron Technology Inc 功能描述: |
| MT5500-1/16-X-SP | 制造商:TE Connectivity 功能描述:MT5500-1/16-X-SP |
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