參數(shù)資料
型號: MR16R1624AF0-CK8
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
中文描述: (16Mx16顯示)× 2(4/8/16)件RIMM的模塊,基于256Mb阿芯片,32秒銀行,16K/32ms參考,為2.5V
文件頁數(shù): 10/16頁
文件大?。?/td> 419K
代理商: MR16R1624AF0-CK8
Page 9
Version 1.4 July 2002
MR16R1622(4/8/G)AF0
MR18R1622(4/8/G)AF0(1)
AC Electrical Specifications for RIMM Modules
Table 10: AC Electrical Specifications for RIMM Modules
Symbol
RIMM Module Capacity
512/576MB
256/288MB
128/144MB
64/72MB
Unit
Number of 256/288Mb RDRAM devices
16
8
4
2
Parameter and Condition for RIMM
Modules
Freq.
Max
Max
Max
Max
T
PD
Propagation Delay, all RSL signals
-1066
2.11
1.56
1.56
1.56
ns
-800
2.11
1.56
1.56
1.56
V
α
/V
IN
Attenuation Limit
-1066
27.0
17.0
17.0
17.0
%
-800
25.0
16.0
16.0
16.0
V
XF
/V
IN
Forward crosstalk coefficient
(300ps input rise time @ 20%-80%)
-1066
8.0
4.0
4.0
4.0
%
-800
8.0
4.0
4.0
4.0
V
XB
/V
IN
Backward crosstalk coefficient
(300ps input rise time @ 20%-80%)
-1066
2.5
2.0
2.0
2.0
%
-800
2.5
2.0
2.0
2.0
R
DC
DC Resistance Limit
-1066
1.2
0.8
0.6
0.6
-800
1.2
0.8
0.6
0.6
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