參數(shù)資料
型號: MR18R1624AF0-CK8
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
中文描述: (16Mx16顯示)× 2(4/8/16)件RIMM的模塊,基于256Mb阿芯片,32秒銀行,16K/32ms參考,為2.5V
文件頁數(shù): 1/16頁
文件大?。?/td> 419K
代理商: MR18R1624AF0-CK8
Page 0
Version 1.4 July 2002
MR16R1622(4/8/G)AF0
MR18R1622(4/8/G)AF0(1)
Change History
Version 1.1 (August 2001)
* First copy.
* Based on the 1.0ver Rambus 256/288Mbit RIMM
Module Datasheet
Version 1.2 (February 2002)
* Add 1066-35 binning
Version 1.3 (April 2002)
* Add 800-40 and 1066-32 binning
* Modify
T
PD
Value of AC electrical specifications
* Modify the
Values of AC electrical specifications for RIMM Module
Version 1.4 (July 2002)
* Add 1066-32 512MB (16d RIMM Module) etc.
相關(guān)PDF資料
PDF描述
MR18R1628AF0-CK8 (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
MR18R162GAF0-CK8 (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
MR16R1628AF0-CM8 (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
MR16R162GAF0-CM8 (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
MR18R1622AF0-CM8 (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MR18R1624AF0-CM8 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
MR18R1624AF1-CN9 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
MR18R1624AF1-CT9 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
MR18R1624EG0-CK8 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:Key Timing Parameters
MR18R1624EG0-CM8 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:Key Timing Parameters