參數(shù)資料
型號: MPM21CUA650B
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 650 MHz, MICROPROCESSOR, XMA
封裝: MMC-2
文件頁數(shù): 55/64頁
文件大?。?/td> 826K
代理商: MPM21CUA650B
Celeron
Processor Mobile Module MMC-2
at 700 MHz, 650 MHz, 600 MHz, 550 MHz, 500 MHz, and 450 MHz
243357-005
Datasheet
53
Figure 23. CPU Thermal Transfer Plate (Reference Only)
6.3
Mobile Module Physical Support
6.3.1
Mobile Module Mounting Requirements
Three mounting holes are available for securing the mobile module to the system base or the
system electronics. See Figure 17 for mounting hole locations. These hole locations and board edge
clearances will remain fixed for all Intel mobile modules. All three mounting holes should be used
to ensure long term mechanical reliability and EMI integrity of the system. The board edge
clearance includes a 0.762-mm (0.030 inches) wide EMI containment ring around the perimeter of
the module. This ring is on each layer of the module PCB and is grounded. The hole patterns also
have a plated surrounding ring to use a metal standoff for EMI shielding purposes. Standoffs
should be used to provide support for the installed mobile module. However, the warpage of the
baseboard can vary and should be calculated into the final dimensions of the standoffs used. All
calculations can be made with the Intel
MMC-2 Standoff/Receptacle Height Spreadsheet.
Information on this spreadsheet can be obtained from your local Intel representative.
Figure 24 shows the standoff support hole details, the board edge clearance, and the dimensions of
the EMI containment ring. No components are placed on the board in the keep-out area.
相關(guān)PDF資料
PDF描述
MPM21CUA550B 32-BIT, 550 MHz, MICROPROCESSOR, XMA
MPM21CUB600A 32-BIT, 600 MHz, MICROPROCESSOR, XMA
MPM21CUB500A 32-BIT, 500 MHz, MICROPROCESSOR, XMA
MPM21CUB600B 32-BIT, 600 MHz, MICROPROCESSOR, XMA
MPM21CUB450A 32-BIT, 450 MHz, MICROPROCESSOR, XMA
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