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參數(shù)資料
| 型號： | MPE603PRX166LX |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 167 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 1.27 MM PITCH, CBGA-255 |
| 文件頁數(shù)： | 24/36頁 |
| 文件大?。?/td> | 411K |
| 代理商： | MPE603PRX166LX |
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PRELIMINAR
Y
30
PID7v-EC603e Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Figure 17 shows typical thermal performance data for the 21 mm CBGA package mounted to a test card.
Figure 15. CBGA Thermal Management Example
Temperature calculations are also performed identically to those in the previous section. For a power
consumption of 2.5 Watts in an ambient of 40
° C at 1.0 m/sec, the associated overall thermal resistance and
junction temperature, found in Table 13, will result.
Vendors such as Aavid Engineering Inc., Thermalloy, and Wakeeld Engineering can supply heat sinks with
a wide range of thermal performance. Refer to Section 1.8.6.1.2, “Thermal Management Example,” for
contact information.
Table 13. Thermal Resistance and Junction Temperature
Conguration
θja (°C/W)
Tj (
°C)
Exposed die (no heat sink)
18.4
86
With 2338 heat sink
5.3
53
Approach Air Velocity (m/sec)
0
5
10
15
20
01
2
3
4
CBGA with Exposed Die
25
5
CBGA with Thermalloy
2338B-Pin Fin Heat Sink
Assumptions:
1. 2P card with 1 OZ Cu planes
2. 63 mm x 76 mm card
3. Air flow on both sides of card
4. Vertical orientation
5. 2-stage epoxy heat sink attach
θ ja
(
°C/W)
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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.
ARCHIVED
BY
FREESCALE
SEMICONDUCT
OR,
INC.
2006
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