參數(shù)資料
型號： MPC8544EDVTANG
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 400 MHz, MICROPROCESSOR, PBGA783
封裝： 29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FC-PBGA-783
文件頁數(shù)： 11/128頁
文件大小： 1411K
代理商： MPC8544EDVTANG
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
108
Freescale Semiconductor
Thermal
20.3.2
Thermal Interface Materials
A thermal interface material is required at the package-to-heat sink interface to minimize the thermal
contact resistance. For those applications where the heat sink is attached by spring clip mechanism,
Figure 63 shows the thermal performance of three thin-sheet thermal-interface materials (silicone,
graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure.
As shown, the performance of these thermal interface materials improves with increasing contact pressure.
The use of thermal grease significantly reduces the interface thermal resistance. The bare joint results in a
thermal resistance approximately six times greater than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 61). Therefore, the synthetic grease offers the best thermal performance, especially at the low
interface pressure.
Figure 63. Thermal Performance of Select Thermal Interface Materials
The system board designer can choose between several types of thermal interface. There are several
commercially-available thermal interfaces provided by the following vendors:
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
0
0.5
1
1.5
2
0
1020304050
60
7080
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Speci
fi
c
The
rm
a
lR
e
si
st
a
n
ce
(K-
in.
2
/W
)
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