參數(shù)資料
型號(hào): MPC853TZT66A
廠商: Freescale Semiconductor
文件頁數(shù): 88/88頁
文件大?。?/td> 0K
描述: IC MPU PWRQUICC 66MHZ 256-PBGA
標(biāo)準(zhǔn)包裝: 60
系列: MPC8xx
處理器類型: 32-位 MPC8xx PowerQUICC
速度: 66MHz
電壓: 1.8V
安裝類型: 表面貼裝
封裝/外殼: 256-BGA
供應(yīng)商設(shè)備封裝: 256-PBGA(23x23)
包裝: 托盤
MPC853T Hardware Specification, Rev. 1
Freescale Semiconductor
9
Thermal Calculation and Measurement
7
Thermal Calculation and Measurement
For the following discussions, PD= (VDDL × IDDL) + PI/O, where PI/O is the power dissipation of the I/O drivers.
NOTE
The VDDSYN power dissipation is negligible.
7.1 Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, TJ, in °C can be obtained from the following equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature C
RθJA = package junction-to-ambient thermal resistance (C/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy estimation
of thermal performance. However, the answer is only an estimate; test cases have demonstrated that errors of a factor
of two (in the quantity TJ –TA) are possible.
Output high voltage, IOH = –2.0 mA, VDDH = 3.0 V
(except XTAL and open-drain pins)
VOH
2.4
V
Output low voltage
IOL = 2.0 mA (CLKOUT)
IOL = 3.2 mA 3
IOL = 5.3 mA 4
IOL = 7.0 mA (Txd1/pa14, txd2/pa12)
IOL = 8.9 mA (TS, TA, TEA, BI, BB, HRESET,
SRESET)
VOL
—0.5
V
1
The PA[0:3], PA[8:11], PB15, PB[24:25]; PB[28:31], PC[4:7], PC[12:13], PC15, PD[3:15], TDI, TDO, TCK, TRST,
TMS, MII_TXEN, and MII_MDIO are 5-V tolerant pins.
2
Input capacitance is periodically sampled.
3
A(0:31), TSIZ0/REG, TSIZ1, D(0:31), DP(0:3)/IRQ(3:6), RD/WR, BURST, RSV/IRQ2, IWP(0:1)/VFLS(0:1),
RXD3/PA11, TXD3/PA10, RXD4/PA9, TXD4/PA8, TIN3/BRGO3/CLK5/PA3, BRGCLK2/TOUT3/CLK6/PA2,
TIN4/BRGO4/CLK7/PA1, TOUT4/CLK8/PA0, SPISEL/PB31, SPICLK/PB30, SPIMOSI/PB29,
BRGO4/SPIMISO/PB28, SMTXD1/PB25, SMRXD1/PB24, BRGO3/PB15, RTS1/DREQ0/PC15, RTS3/PC13,
RTS4/PC12, CTS3/PC7, CD3/PC6, CTS4/SDACK1/PC5, CD4/PC4, MII-RXD3/PD15, MII-RXD2/PD14,
MII-RXD1/PD13, MII-MDC/PD12, MII-TXERR/RXD3/PD11, MII-RX0/TXD3/PD10, MII-TXD0/RXD4/PD9,
MII-RXCLK/TXD4/PD8, MII-TXD3/PD5, MII-RXDV/RTS4/PD6, MII-RXERR/RTS3/PD7, MII-TXD2/REJECT3/PD4,
MII-TXD1/REJECT4/PD3, MII_CRS, MII_MDIO, MII_TXEN, MII_COL
4
BDIP/GPL_B(5), BR, BG, FRZ/IRQ6, CS(0:5), CS(6), CS(7), WE0/BS_B0/IORD, WE1/BS_B1/IOWR,
WE2/BS_B2/PCOE, WE3/ BS_B3/PCWE, BS_A(0:3), GPL_A0/GPL_B0, OE/GPL_A1/GPL_B1,
GPL_A(2:3)/GPL_B(2:3)/CS(2:3), UPWAITA/GPL_A4, GPL_A5, ALE_A, CE1_A, CE2_A, DSCK, OP(0:1),
OP2/MODCK1/STS, OP3/MODCK2/DSDO, BADDR(28:30)
Table 5. DC Electrical Specifications (continued)
Characteristic
Symbol
Min
Max
Unit
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