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  • 參數(shù)資料
    型號: MPC853TZT66A
    廠商: Freescale Semiconductor
    文件頁數(shù): 67/88頁
    文件大?。?/td> 0K
    描述: IC MPU PWRQUICC 66MHZ 256-PBGA
    標準包裝: 60
    系列: MPC8xx
    處理器類型: 32-位 MPC8xx PowerQUICC
    速度: 66MHz
    電壓: 1.8V
    安裝類型: 表面貼裝
    封裝/外殼: 256-BGA
    供應(yīng)商設(shè)備封裝: 256-PBGA(23x23)
    包裝: 托盤
    MPC853T Hardware Specification, Rev. 1
    Freescale Semiconductor
    7
    Thermal Characteristics
    4
    Thermal Characteristics
    Table 3 shows the thermal characteristics for the MPC853T.
    5
    Power Dissipation
    Table 4 provides power dissipation information. The modes are 1:1, where CPU and bus speeds are equal, and 2:1
    mode, where CPU frequency is twice bus speed.
    Table 3. MPC853T Thermal Resistance Data
    Rating
    Environment
    Symbol
    Value
    Unit
    Junction-to-ambient 1
    1
    Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
    temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
    resistance.
    Natural convection
    Single-layer board (1s)
    RθJA
    2
    Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
    49
    °C/W
    Four-layer board (2s2p)
    RθJMA
    3
    Per JEDEC JESD51-6 with the board horizontal.
    32
    Airflow (200 ft/min)
    Single-layer board (1s)
    RθJMA
    41
    Four-layer board (2s2p)
    RθJMA
    29
    Junction-to-board 4
    4
    Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
    measured on the top surface of the board near the package.
    RθJB
    24
    Junction-to-case 5
    5
    Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
    method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed
    pad packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated
    value from the junction to the exposed pad without contact resistance.
    RθJC
    13
    Junction-to-package top 6
    6
    Thermal characterization parameter indicating the temperature difference between package top and the junction
    temperature per JEDEC JESD51-2.
    Natural convection
    ΨJT
    3
    Airflow (200 ft/min)
    ΨJT
    2
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