參數(shù)資料
型號(hào)： MPC8536EBVTANGA
廠商： Freescale Semiconductor
文件頁數(shù)： 43/126頁
文件大?。?/td> 0K
描述： MPU PWRQUICC III 800MHZ 783PBGA
產(chǎn)品培訓(xùn)模塊： MPC8536E QUICC III Processor
標(biāo)準(zhǔn)包裝： 1
系列： MPC85xx
處理器類型： 32-位 MPC85xx PowerQUICC III
速度： 800MHz
電壓： 1V
安裝類型： 表面貼裝
封裝/外殼： 783-BBGA，F(xiàn)CBGA
供應(yīng)商設(shè)備封裝： 783-FCPBGA（29x29）
包裝： 托盤
其它名稱： MPC8536EBVTANG
MPC8536EBVTANG-ND
Electrical Characteristics
MPC8536E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
23
Core power supply for SerDes transceivers
SVDD
1.0 ± 50 mV
V
—
Pad power supply for SerDes transceivers and PCI Express
XVDD
1.0 ± 50 mV
V
—
DDR SDRAM
Controller I/O supply
voltage
DDR2 SDRAM Interface
GVDD
1.8 V ± 90 mV
V
3
DDR3 SDRAM Interface
1.5 V ± 75 mV
Three-speed Ethernet I/O voltage
LVDD
(eTSEC1)
3.3 V ± 165 mV
2.5 V ± 125 mV
V5
TVDD
(eTSEC3)
3.3 V ± 165 mV
2.5 V ± 125 mV
PCI, DUART, system control and power management, I2C, USB, eSDHC,
eSPI and JTAG I/O voltage, MII management voltage
OVDD
3.3 V ± 165 mV
V
4
Local bus I/O voltage
BVDD
3.3 V ± 165 mV
2.5 V ± 125 mV
1.8 V ± 90 mV
V—
Input voltage
DDR2 and DDR3 SDRAM Interface signals
MVIN
GND to GVDD
V3
DDR2 and DDR3 SDRAM Interface reference
MVREF
GVDD/2 ± 1%
V
—
Three-speed Ethernet signals
LVIN
TVIN
GND to LVDD
GND to TVDD
V5
Local bus signals
BVIN
GND to BVDD
V—
PCI, Local bus, DUART, SYSCLK, system control
and power management, I2C, and JTAG signals
OVIN
GND to OVDD
V4
Operating
Temperature range
Commercial
TA
TJ
TA= 0 (min) to
T
J= 90(max)
°C6
Industrial
standard temperature range
Extended temperature range
TA= 0 (min) to
TJ= 105 (max)
TA= -40 (min) to
TJ= 105 (max)
Notes:
1. VDD = 1.0 V for 600 to 1333 MHz, 1.1 V for 1500 MHz,
2. This voltage is the input to the filter discussed in Section 3.2.1, “PLL Power Supply Filtering,” and not necessarily the voltage
at the AVDD pin, which may be reduced from VDD by the filter.
3. Caution: MVIN must not exceed GVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
4. Caution: OVIN must not exceed OVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
5. Caution: L/TVIN must not exceed L/TVDD by more than 0.3 V. This limit may be exceeded for a maximum of 20 ms during
power-on reset and power-down sequences.
6. Minimum temperature is specified with TA; maximum temperature is specified with TJ.
Table 3. Recommended Operating Conditions (continued)
Characteristic
Symbol
Recommended Value Unit Notes
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8536EBVTAQG 功能描述:微處理器 - MPU 32-BIT 1GHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8536EBVTAQGA 功能描述:微處理器 - MPU 8536 Encrypted RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8536EBVTATH 功能描述:微處理器 - MPU 32-BIT 1.25GHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8536EBVTATHA 功能描述:微處理器 - MPU 8536 Encrypted RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8536EBVTATLA 功能描述:微處理器 - MPU 8536 ENCRYPTED RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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