參數(shù)資料
型號: MPC8533EVTAQFB
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 1000 MHz, RISC PROCESSOR, PBGA783
封裝: 29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-783
文件頁數(shù): 35/116頁
文件大?。?/td> 1277K
代理商: MPC8533EVTAQFB
MPC8533E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
25
Enhanced Three-Speed Ethernet (eTSEC), MII Management
8.3
FIFO, GMII,MII, TBI, RGMII, RMII, and RTBI AC Timing
Specifications
The AC timing specifications for FIFO, GMII, MII, TBI, RGMII, RMII, and RTBI are presented in this
section.
8.3.1
FIFO AC Specifications
The basis for the AC specifications for the eTSEC FIFO modes is the double data rate RGMII and RTBI
specifications, since they have similar performance and are described in a source-synchronous fashion like
Input low current (VIN = GND)
IIL
–600
μA3
Notes:
1. LVDD supports eTSEC1.
2. TVDD supports eTSEC3.
3. The symbol VIN, in this case, represents the LVIN and TVIN symbols referenced in Table 1 and Table 2.
Table 22. GMII, MII, RMII, RGMII, RTBI, TBI, and FIFO DC Electrical Characteristics
Parameters
Symbol
Min
Max
Unit
Notes
Supply voltage 2.5 V
LVDD/TVDD
2.375
2.625
V
1, 2
Output high voltage (LVDD/TVDD = Min, IOH = –1.0 mA)
VOH
2.0
V
Output low voltage (LVDD/TVDD = Min, IOL = 1.0 mA)
VOL
—0.4
V
Input high voltage
VIH
1.70
V
Input low voltage
VIL
—0.7
V
Input current (VIN = 0, VIN = LVDD, VIN = TVDD)IIN
—±15
μA
1, 2, 3
Notes:
1. LVDD supports eTSEC1.
2. TVDD supports eTSEC3.
3. The symbol VIN, in this case, represents the LVIN and TVIN symbols referenced in Table 1 and Table 2.
Table 21. GMII, MII, TBI, RMII and FIFO DC Electrical Characteristics (continued)
Parameter
Symbol
Min
Max
Unit
Notes
TX
Silicon
+ Package
C = CTX
R = 50
Ω
R = 50
Ω
D+ Package
Pin
D– Package
Pin
D+ Package
Pin
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