參數資料
型號: MPC8360EA-MDS-PB
廠商: Freescale Semiconductor
文件頁數: 101/102頁
文件大?。?/td> 0K
描述: KIT APPLICATION DEV 8360 SYSTEM
標準包裝: 1
系列: PowerQUICC II™ PRO
類型: MPU
適用于相關產品: MPC8360EA
所含物品:
相關產品: MPC8360ZUALFHA-ND - IC MPU POWERQUICC II PRO 740TBGA
MPC8360ZUAJDGA-ND - IC MPU POWERQUICC II PRO 740TBGA
MPC8360ZUAGDGA-ND - IC MPU POWERQUICC II PRO 740TBGA
MPC8360VVALFHA-ND - IC MPU POWERQUICC II PRO 740TBGA
MPC8360VVAJDGA-ND - IC MPU POWERQUICC II PRO 740TBGA
MPC8360VVAGDGA-ND - IC MPU POWERQUICC II PRO 740TBGA
MPC8360EZUALFHA-ND - IC MPU POWERQUICC II PRO 740TBGA
MPC8360EZUAJDGA-ND - IC MPU POWERQUICC II PRO 740TBGA
MPC8360EZUAGDGA-ND - IC MPU POWERQUICC II PRO 740TBGA
MPC8360EVVALFHA-ND - IC MPU POWERQUICC II PRO 740TBGA
更多...
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
98
Freescale Semiconductor
Configuration Pin Muxing
Figure 57. Driver Impedance Measurement
The value of this resistance and the strength of the driver’s current source can be found by making two measurements. First, the
output voltage is measured while driving logic 1 without an external differential termination resistor. The measured voltage is
V1 = Rsource × Isource. Second, the output voltage is measured while driving logic 1 with an external precision differential
termination resistor of value Rterm. The measured voltage is V2 = 1/(1/R1 +1/R2)) × Isource. Solving for the output impedance
gives Rsource = Rterm × (V1/V2 – 1). The drive current is then Isource =V1/Rsource.
This table summarizes the signal impedance targets. The driver impedance are targeted at minimum VDD, nominal OVDD,
105
° C.
23.6
Configuration Pin Muxing
The device provides the user with power-on configuration options that can be set through the use of external pull-up or
pull-down resistors of 4.7 k
Ωon certain output pins (see customer visible configuration pins). These pins are generally used as
output only pins in normal operation.
While HRESET is asserted however, these pins are treated as inputs. The value presented on these pins while HRESET is
asserted, is latched when HRESET deasserts, at which time the input receiver is disabled and the I/O circuit takes on its normal
function. Careful board layout with stubless connections to these pull-up/pull-down resistors coupled with the large value of the
pull-up/pull-down resistor should minimize the disruption of signal quality or speed for output pins thus configured.
Table 79. Impedance Characteristics
Impedance
Local Bus, Ethernet, DUART,
Control, Configuration, Power
Management
PCI
DDR DRAM
Symbol
Unit
RN
42 Target
25 Target
20 Target
Z0
W
RP
42 Target
25 Target
20 Target
Z0
W
Differential
NA
ZDIFF
W
Note: Nominal supply voltages. See Table 1, TJ = 105° C.
OVDD
OGND
RP
RN
Pad
Data
SW1
SW2
相關PDF資料
PDF描述
AG001-01 KIT ENGINEERING EVALUATION
D-SCE-1K-6.4-50-9 HEAT SHRINK SLEEVE MARKER
AIRD-02-271K INDUCTOR PWR DRUM CORE 270UH
SPX1431M1-L/TR IC VREF SHUNT PREC ADJ SOT-89-3
DS2790E+ IC FUEL GAUGE BATT 28TSSOP
相關代理商/技術參數
參數描述
MPC8360ECVVADDH 功能描述:微處理器 - MPU 8360 TBGA ENCRP NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8360ECVVAGDG 功能描述:微處理器 - MPU 8360 TBGA ENCRP NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8360ECVVAGDGA 功能描述:微處理器 - MPU 8360 TBGA C ENC NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8360ECVVAGDHA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ECVVAGFGA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications