參數(shù)資料
型號(hào): MPC8358ECVRAGDGA
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 4/95頁(yè)
文件大?。?/td> 0K
描述: MPU POWERQUICC II PRO 668-PBGA
標(biāo)準(zhǔn)包裝: 36
系列: MPC83xx
處理器類型: 32-位 MPC83xx PowerQUICC II Pro
速度: 400MHz
電壓: 1.2V
安裝類型: 表面貼裝
封裝/外殼: 668-BBGA 裸露焊盤
供應(yīng)商設(shè)備封裝: 668-PBGA-PGE(29x29)
包裝: 托盤
MPC8358E PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications, Rev. 3
12
Freescale Semiconductor
Power Characteristics
Figure 4. Power Sequencing Example
I/O voltage supplies (GVDD, LVDD, and OVDD) do not have any ordering requirements with respect to one
another.
2.2.2
Power-Down Sequencing
The MPC8358E does not require the core supply voltage and I/O supply voltages to be powered down in
any particular order.
3
Power Characteristics
The estimated typical power dissipation values are shown in Table 4.
Table 4. MPC8358E PBGA Core Power Dissipation1
Core
Frequency (MHz)
CSB
Frequency (MHz)
QUICC Engine
Frequency (MHz)
Typical
Maximum
Unit
Notes
266
2.2
2.3
W
2, 3, 4
400
266
2.4
2.5
W
2, 3, 4
400
266
400
2.5
2.6
W
2, 3, 4
Notes:
1. The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD. For I/O power values, see Table 5.
2. Typical power is based on a voltage of VDD = 1.2 V, a junction temperature of TJ = 105°C, and a Dhrystone benchmark
application.
3. Thermal solutions will likely need to design to a value higher than typical power on the end application, TA target, and I/O
power.
4. Maximum power is based on a voltage of VDD = 1.2 V, WC process, a junction TJ = 105°C, and an artificial smoke test.
I/O Voltage (GVDD, LVDD, OVDD)
Core Voltage (VDD, AVDD)
90%
0.7 V
Time
Voltage
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