參數(shù)資料
MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4
42
Freescale Semiconductor
TDM/SI
17.2
TDM/SI AC Timing Specifications
Table 47 provides the TDM/SI input and output AC timing specifications.
Figure 33 provides the AC test load for the TDM/SI.
Figure 33. TDM/SI AC Test Load
Figure 34 represents the AC timing from Table 47. Note that although the specifications generally
reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge is the
active edge.
Figure 34. TDM/SI AC Timing (External Clock) Diagram
Input low voltage
VIL
—
–0.3
0.8
V
Input current
IIN
0 V
≤ VIN ≤ OVDD
—±5
μA
Table 47. TDM/SI AC Timing Specifications1
Characteristic
Symbol2
Min
Max
Unit
TDM/SI outputs—External clock delay
tSEKHOV
212
ns
TDM/SI outputs—External clock High Impedance
tSEKHOX
210
ns
TDM/SI inputs—External clock input setup time
tSEIVKH
5—
ns
TDM/SI inputs—External clock input hold time
tSEIXKH
2—
ns
Notes:
1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings
are measured at the pin.
2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tSEKHOX symbolizes the TDM/SI
outputs external timing (SE) for the time tTDM/SI memory clock reference (K) goes from the high state (H) until outputs (O)
are invalid (X).
Table 46. TDM/SI DC Electrical Characteristics (continued)
Characteristic
Symbol
Condition
Min
Max
Unit
Output
Z0 = 50 Ω
OVDD/2
RL = 50 Ω
TDM/SICLK (Input)
tSEIXKH
tSEIVKH
tSEKHOV
Input Signals:
TDM/SI
(See Note)
Output Signals:
TDM/SI
(See Note)
Note: The clock edge is selectable on TDM/SI.
tSEKHOX
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