參數(shù)資料
型號(hào): MPC8308CVMAFD
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 77/83頁(yè)
文件大?。?/td> 0K
描述: MPU POWERQUICC II PRO 473MAPBGA
產(chǎn)品培訓(xùn)模塊: MPC8308 PowerQUICC II Pro Processor
特色產(chǎn)品: MPC8308 PowerQUICC? II Pro Processor
標(biāo)準(zhǔn)包裝: 84
系列: MPC83xx
處理器類型: 32-位 MPC83xx PowerQUICC II Pro
速度: 333MHz
電壓: 1V
安裝類型: 表面貼裝
封裝/外殼: 473-LFBGA
供應(yīng)商設(shè)備封裝: 473-MAPBGA(19x19)
包裝: 托盤
MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 3
Freescale Semiconductor
79
System Design Information
Figure 55. Driver Impedance Measurement
The value of this resistance and the strength of the driver’s current source can be found by making two
measurements. First, the output voltage is measured while driving logic 1 without an external differential
termination resistor. The measured voltage is V1 = Rsource Isource. Second, the output voltage is measured
while driving logic 1 with an external precision differential termination resistor of value Rterm. The
measured voltage is V2 =(1/(1/R1 +1/R2)) Isource. Solving for the output impedance gives Rsource =
Rterm (V1/V2 – 1). The drive current is then Isource =V1/Rsource.
This table summarizes the signal impedance targets. The driver impedance are targeted at minimum VDD,
nominal NVDD, 105C.
23.6
Configuration Pin Muxing
The device provides the user with power-on configuration options which can be set through the use of
external pull-up or pull-down resistors of 4.7 K
on certain output pins (see customer visible
configuration pins). These pins are generally used as output only pins in normal operation.
While PORESET is asserted however, these pins are treated as inputs. The value presented on these pins
while PORESET is asserted, is latched when PORESET deasserts, at which time the input receiver is
disabled and the I/O circuit takes on its normal function. Careful board layout with stubless connections
to these pull-up/pull-down resistors coupled with the large value of the pull-up/pull-down resistor should
minimize the disruption of signal quality or speed for output pins thus configured.
Table 60. Impedance Characteristics
Impedance
Local Bus, Ethernet, DUART, Control,
Configuration, Power Management
DDR DRAM
Symbol
Unit
RN
42 Target
20 Target
Z0
RP
42 Target
20 Target
Z0
Note: Nominal supply voltages. See Table 2, Tj = 105C.
NVDD
VSS
RP
RN
Pad
Data
SW1
SW2
相關(guān)PDF資料
PDF描述
IDT709349L9PF8 IC SRAM 72KBIT 9NS 100TQFP
IDT709159L9PF8 IC SRAM 72KBIT 9NS 100TQFP
IDT70V24S55PF8 IC SRAM 64KBIT 55NS 100TQFP
IDT70V05S55PF8 IC SRAM 64KBIT 55NS 64TQFP
ABB80DHBN CONN EDGECARD 160PS R/A .050 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8308CVMAFDA 功能描述:微處理器 - MPU E300 ext tmp Qual 333 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8308CVMAGD 功能描述:微處理器 - MPU E300 EXT TMP 400 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8308CVMAGDA 功能描述:微處理器 - MPU E300 EXT TMP 400 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8308CZQADD 功能描述:微處理器 - MPU E300 ext tmp Qual266 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8308CZQADDA 功能描述:微處理器 - MPU E300 ext tmp Qual266 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324