參數(shù)資料
型號(hào): MPC8245TZU350D
廠商: Freescale Semiconductor
文件頁數(shù): 25/68頁
文件大小: 0K
描述: IC MPU 32BIT 350MHZ 352-TBGA
標(biāo)準(zhǔn)包裝: 24
系列: MPC82xx
處理器類型: 32-位 MPC82xx PowerQUICC II
速度: 350MHz
電壓: 2V
安裝類型: 表面貼裝
封裝/外殼: 352-LBGA
供應(yīng)商設(shè)備封裝: 352-TBGA(35x35)
包裝: 托盤
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
31
Package Description
Figure 23. Test Access Port Timing Diagram
5
Package Description
This section details package parameters, pin assignments, and dimensions.
5.1
Package Parameters
The MPC8245 uses a 35 mm
× 35 mm, cavity-up, 352-pin tape ball grid array (TBGA) package. The
package parameters are as follows.
Package Outline
35 mm
× 35 mm
Interconnects
352
Pitch
1.27 mm
Solder Balls
ZU (TBGA package)62 Sn/36 Pb/2 Ag
VV (Lead-free version of package)95.5 Sn/4.0 Ag/0.5 Cu
Solder Ball Diameter
0.75 mm
Maximum Module Height
1.65 mm
Co-Planarity Specification
0.15 mm
Maximum Force
6.0 lbs. total, uniformly distributed over package (8 grams/ball)
10
11
Input Data Valid
12
13
Output Data Valid
TCK
TDI, TMS
TDO
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