參數(shù)資料
型號(hào)： MPC755BRX350LE
廠商： MOTOROLA INC
元件分類(lèi)： 微控制器/微處理器
英文描述： RISC Microprocessor Hardware Specifications
中文描述： 32-BIT, 350 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, CERAMIC, BGA-360
文件頁(yè)數(shù)： 7/56頁(yè)
文件大?。?/td> 1652K
代理商： MPC755BRX350LE
MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
7
Electrical and Thermal Characteristics
Core power supply
2.0 V ± 100 mV DC (nominal; some parts support core voltages down to 1.8 V;
see
Table 3
for recommended operating conditions)
2.5 V ± 100 mV DC or
3.3 V ± 165 mV DC (input thresholds are configuration pin selectable)
I/O power supply
4
Electrical and Thermal Characteristics
This section provides the AC and DC electrical specifications and thermal characteristics for the MPC755.
4.1
DC Electrical Characteristics
Table 1
through
Table 7
describe the MPC755 DC electrical characteristics.
Table 1
provides the absolute maximum
ratings.
Table 1. Absolute Maximum Ratings
1
Characteristic
Symbol
Maximum Value
Unit
Notes
Core supply voltage
V
DD
–0.3 to 2.5
V
4
PLL supply voltage
AV
DD
–0.3 to 2.5
V
4
L2 DLL supply voltage
L2AV
DD
–0.3 to 2.5
V
4
Processor bus supply voltage
OV
DD
–0.3 to 3.6
V
3
L2 bus supply voltage
L2OV
DD
–0.3 to 3.6
V
3
Input voltage
Processor bus
V
in
–0.3 to OV
DD
+ 0.3 V
V
2, 5
L2 bus
V
in
–0.3 to L2OV
DD
+ 0.3 V
V
2, 5
JTAG signals
V
in
–0.3 to 3.6
V
Storage temperature range
T
stg
–55 to 150
°C
Notes:
1. Functional and tested operating conditions are given in
Table 3
. Absolute maximum ratings are stress ratings only, and functional operation
at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause permanent damage to the device.
2.
Caution:
Vin must not exceed OV
DD
or L2OV
DD
by more than 0.3 V at any time including during power-on reset.
3.
Caution:
L2OV
DD
/OV
DD
must not exceed V
DD
/AV
DD
/L2AV
DD
by more than 1.6 V during normal operation. During power-on reset and
power-down sequences, L2OV
DD
/OV
DD
may exceed V
DD
/AV
DD
/L2AV
DD
by up to 3.3 V for up to 20 ms, or by 2.5 V for up to 40 ms.
Excursions beyond 3.3 V or 40 ms are not supported.
4.
Caution:
V
DD
/AV
DD
/L2AV
DD
must not exceed L2OV
DD
/OV
DD
by more than 0.4 V during normal operation. During power-on reset and
power-down sequences, V
DD
/AV
DD
/L2AV
DD
may exceed L2OV
DD
/OV
DD
by up to 1.0 V for up to 20 ms, or by 0.7 V for up to 40 ms.
Excursions beyond 1.0 V or 40 ms are not supported.
5. This is a DC specifications only. V
in
may overshoot/undershoot to a voltage and for a maximum duration as shown in
Figure 2
.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC755BRX350TE 功能描述:微處理器 - MPU 360CBGA,RV2.8,HIP4DP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755BVT300LE 功能描述:微處理器 - MPU RV2.8106C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755BVT350LE 功能描述:微處理器 - MPU RV2.8,106C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX350LE 功能描述:微處理器 - MPU 360PBGA,RV2.8,6W RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC755CPX400LE 功能描述:微處理器 - MPU GF RV2.8360PBGA 4A105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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