參數(shù)資料
型號(hào): MPC7410HX500LE
廠商: Freescale Semiconductor
文件頁數(shù): 40/56頁
文件大小: 0K
描述: IC MPU 32BIT 500MHZ 360-CBGA
標(biāo)準(zhǔn)包裝: 44
系列: MPC74xx
處理器類型: 32-位 MPC74xx PowerPC
速度: 500MHz
電壓: 1.8V
安裝類型: 表面貼裝
封裝/外殼: 360-BBGA,F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝: 360-FCCBGA(25x25)
包裝: 托盤
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
45
System Design Information
Figure 29 describes the thermal performance of selected thermal interface materials.
Figure 29. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials should be
selected based on high conductivity, yet adequate mechanical strength to meet equipment shock/vibration
requirements. There are several commercially-available thermal interfaces and adhesive materials provided by the
following vendors:
Chomerics, Inc.
781-935-4850
77 Dragon Court
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
Shin-Etsu MicroSi, Inc.
888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
0
0.5
1
1.5
2
0
10
20
3040506070
80
Silicone Sheet (0.006")
Bare Joint
Floroether Oil Sheet (0.007")
Graphite/Oil Sheet (0.005")
Synthetic Grease
Contact Pressure (psi)
Spec
if
ic
Ther
m
a
lResi
st
ance
(K
-i
n.
2
/W
)
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MPC7410RX500LE 功能描述:IC MPU 32BIT 500MHZ PPC 360-CBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC74xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA(25x25) 包裝:托盤