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| 型號： | MPC7410HX400LE |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 42/56頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU 32BIT LP HP 360-CBGA |
| 標準包裝： | 44 |
| 系列： | MPC74xx |
| 處理器類型： | 32-位 MPC74xx PowerPC |
| 速度： | 400MHz |
| 電壓： | 1.8V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 360-BBGA，F(xiàn)CCBGA |
| 供應(yīng)商設(shè)備封裝： | 360-FCCBGA（25x25） |
| 包裝： | 托盤 |
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MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
47
System Design Information
Figure 30. Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common figure-of-merit
used for comparing the thermal performance of various microelectronic packaging technologies, one should
exercise caution when only using this metric in determining thermal management because no single parameter can
adequately describe three-dimensional heat flow. The final die-junction operating temperature, is not only a function
of the component-level thermal resistance, but the system-level design and its operating conditions. In addition to
the component's power consumption, a number of factors affect the final operating die-junction
temperature—airflow, board population (local heat flux of adjacent components), heat sink efficiency, heat sink
attach, heat sink placement, next-level interconnect technology, system air temperature rise, altitude, and so on.
Due to the complexity and the many variations of system-level boundary conditions for today's microelectronic
equipment, the combined effects of the heat transfer mechanisms (radiation, convection, and conduction) may vary
widely. For these reasons, we recommend using conjugate heat transfer models for the board, as well as,
system-level designs.
1
3
5
7
8
00.5
11.5
22.5
3
3.5
Approach Air Velocity (m/s)
Heat
Si
nk
Ther
m
a
lRes
is
tan
ce
(
C/
W
)
(25
× 28 × 15 mm)
2
4
6
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| MPC7410HX400NE | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC7410 RISC Microprocessor Hardware Specifications Addendum |
| MPC7410HX450LE | 功能描述:微處理器 - MPU NT HITCE RV1.4 1.8V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC7410HX450NE | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC7410 RISC Microprocessor Hardware Specifications Addendum |
| MPC7410HX500LE | 功能描述:微處理器 - MPU NT HITCE RV1.4 1.8V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC7410HX500LE | 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 500MHZ 360-FCCBGA |
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