參數(shù)資料
型號(hào): MPC7410HX400LE
廠(chǎng)商: Freescale Semiconductor
文件頁(yè)數(shù): 22/56頁(yè)
文件大?。?/td> 0K
描述: IC MPU 32BIT LP HP 360-CBGA
標(biāo)準(zhǔn)包裝: 44
系列: MPC74xx
處理器類(lèi)型: 32-位 MPC74xx PowerPC
速度: 400MHz
電壓: 1.8V
安裝類(lèi)型: 表面貼裝
封裝/外殼: 360-BBGA,F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝: 360-FCCBGA(25x25)
包裝: 托盤(pán)
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
29
Package Description
7
Package Description
The following sections provide the package parameters and mechanical dimensions for the MPC7410, 360 CBGA
and 360 HCTE packages.
7.1 Package Parameters for the MPC7410, 360 CBGA and
360 HCTE_CBGA
The package parameters are as provided in the following list. The package types are the 25
× 25 mm, 360-lead
ceramic ball grid array package (CBGA) or the 25
× 25 mm, 360-lead high coefficient of thermal expansion CBGA
package (HCTE_CBGA).
Package outline
25
× 25 mm
Interconnects
360 (19
× 19 ball array – 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.72 mm
Maximum module height
3.20 mm
Ball diameter
0.89 mm (35 mil)
Coefficient of thermal expansion
6.8 ppm/°C (CBGA)
12.3ppm/°C (HCTE_CBGA)
7.2 Package Parameters for the MPC7410, 360 HCTE_CBGA (Lead
Free C5 Spheres)
The package parameters are as listed here. The package types are the 25
× 25 mm, 360-lead high coefficient of
thermal expansion CBGA package with lead-free C5 spheres (HCTE_CBGA lead-free spheres).
Package outline
25
× 25 mm
Interconnects
360 (19
× 19 ball array – 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.32 mm
Maximum module height
2.80 mm
Ball diameter
0.76 mm (30 mil)
Coefficient of thermal expansion
12.3ppm/°C
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MPC7410HX400NE 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:MPC7410 RISC Microprocessor Hardware Specifications Addendum
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MPC7410HX450NE 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:MPC7410 RISC Microprocessor Hardware Specifications Addendum
MPC7410HX500LE 功能描述:微處理器 - MPU NT HITCE RV1.4 1.8V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC7410HX500LE 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 500MHZ 360-FCCBGA