參數(shù)資料
型號(hào)： MPC603RVG200LC
廠(chǎng)商： Freescale Semiconductor
文件頁(yè)數(shù)： 15/31頁(yè)
文件大?。?/td> 0K
描述： MPU RISC PID7V-603E 255FCCBGA
標(biāo)準(zhǔn)包裝： 60
系列： MPC6xx
處理器類(lèi)型： 32-位 MPC603e PowerPC
速度： 200MHz
電壓： 2.5V
安裝類(lèi)型： 表面貼裝
封裝/外殼： 255-BCBGA 裸露焊盤(pán)，255-FCCBGA
供應(yīng)商設(shè)備封裝： 255-FCCBGA（21x21）
包裝： 托盤(pán)
PID7t-603e Hardware Specifications, Rev. 5
22
Freescale Semiconductor
System Design Information
using a circuit similar to the one shown in Figure 13. The circuit should be placed as close as possible to
the AVdd pin to ensure it filters out as much noise as possible. The 0.1 F capacitor should be closest to
the AVdd pin, followed by the 10 F capacitor, and finally the 10 resistor to Vdd. These traces should be
kept short and direct.
Figure 13. PLL Power Supply Filter Circuit
8.3
Decoupling Recommendations
Due to the 603e’s dynamic power management feature, large address, data buses, and high-operating
frequencies, it can generate transient power surges and high-frequency noise in its power supply,
especially while driving large capacitive loads. This noise must be prevented from reaching other
components in the 603e system. It requires a clean, tightly regulated source of power. Therefore, it is
recommended that the system designer places at least one decoupling capacitor at each Vdd and OVdd pin
of the 603e. It is also recommended that these decoupling capacitors receive their power from separate
Vdd, OVdd, and GND power planes in the PCB, utilizing short traces to minimize inductance.
These capacitors should vary in value from 220 pF to 10
F to provide both high- and low-frequency
filtering, and should be placed as close as possible to their associated Vdd or OVdd pin. Suggested values
for the Vdd pins are: 220 pF (ceramic), 0.01 F (ceramic), and 0.1 F (ceramic). Suggested values for the
OVdd pins are: 0.01 F (ceramic), 0.1 F (ceramic), and 10 F (tantalum). Only SMT capacitors should
be used to minimize lead inductance.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the Vdd and OVdd planes, to enable quick recharging of the smaller chip capacitors. These bulk
capacitors should also have a low ESR (equivalent series resistance) rating to ensure the quick response
time necessary. They should also be connected to the power and ground planes through two vias to
minimize inductance. Suggested bulk capacitors—100 F (AVX TPS tantalum) or 330 F (AVX TPS
tantalum).
8.4
Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. Unused active low inputs should be tied to Vdd. Unused active high inputs should be connected to
GND. All NC (no-connect) signals must remain unconnected. Power and ground connections must be
made to all external Vdd, OVdd, and GND pins of the 603e.
Vdd
AVdd
10
10 F
0
.1 F
GND
相關(guān)PDF資料
PDF描述
IDT7006S35J8 IC SRAM 128KBIT 35NS 68PLCC
XF2J-1824-11A CONN FPC 18POS 0.5MM PITCH SMD
IDT7006S25J8 IC SRAM 128KBIT 25NS 68PLCC
IDT7006S20J8 IC SRAM 128KBIT 20NS 68PLCC
MPC862PZQ80B IC MPU PWRQUICC 80MHZ 357-PBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC603RVG300LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RZT200LC 功能描述:微處理器 - MPU 603E 255PBGA RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC604E 制造商:MOTOROLA 制造商全稱(chēng):Motorola, Inc 功能描述:PowerPC 604e-TM RISC Microprocessor Technical Summary
MPC6071 制造商:International Rectifier 功能描述:
MPC616 制造商:Hammond Manufacturing 功能描述:6" X 16" MAGNET PANEL COVER
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠(chǎng)商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*