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參數(shù)資料
| 型號： | MPC5602SEMLQ |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, FLASH, 64 MHz, MICROCONTROLLER, PQFP144 |
| 封裝： | 20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LQFP-144 |
| 文件頁數(shù)： | 45/104頁 |
| 文件大?。?/td> | 1729K |
| 代理商： | MPC5602SEMLQ |
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Electrical Characteristics
MPC560xS Microcontroller Data Sheet, Rev. 2
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
45
3.5.1
General Notes for Specifications at Maximum Junction Temperature
TJ = TA + (RθJA × PD)
Eqn. 1
where:
TA
= ambient temperature for the package (°C)
RθJA
= junction to ambient thermal resistance (°C/W)
PD
= power dissipation in the package (W)
The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide consistent values for
estimations and comparisons. The difference between the values determined for the single-layer (1s) board compared to a
four-layer board that has two signal layers, a power and a ground plane (2s2p), demonstrate that the effective thermal resistance
is not a constant. The thermal resistance depends on the:
Construction of the application board (number of planes)
Effective size of the board which cools the component
Quality of the thermal and electrical connections to the planes
Power dissipated by adjacent components
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to connect the package
to the planes reduces the thermal performance. Thinner planes also reduce the thermal performance. When the clearance
between the vias leave the planes virtually disconnected, the thermal performance is also greatly reduced.
As a general rule, the value obtained on a single-layer board is within the normal range for the tightly packed printed circuit
board. The value obtained on a board with the internal planes is usually within the normal range if the application board has:
One oz. (35 micron nominal thickness) internal planes
Components are well separated
Overall power dissipation on the board is less than 0.02 W/cm2
The thermal performance of any component depends on the power dissipation of the surrounding components. In addition, the
ambient temperature varies widely within the application. For many natural convection and especially closed box applications,
the board temperature at the perimeter (edge) of the package is approximately the same as the local air temperature near the
device. Specifying the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using Equation 2:
TJ = TB + (RθJB × PD)
Eqn. 2
where:
TB
= board temperature for the package perimeter (°C)
2 Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package.
3 Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
4 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
5 Thermal characterization parameter indicating the temperature difference between the package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written as Psi-JT.
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