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參數(shù)資料
| 型號： | MMFT3055VT3 |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 小信號晶體管 |
| 英文描述： | 1700 mA, 60 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-261AA |
| 封裝： | CASE 318E-04, 4 PIN |
| 文件頁數(shù)： | 13/17頁 |
| 文件大?。?/td> | 193K |
| 代理商： | MMFT3055VT3 |
MMFT3055V
http://onsemi.com
632
VDS
,DRAIN-T
O-SOURCE
VOL
TAGE
(VOL
TS)
V GS
,GA
TE-T
O-SOURCE
VOL
TAGE
(VOL
TS)
DRAIN–TO–SOURCE DIODE CHARACTERISTICS
0.5
0.55
0.65
0.85
VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
Figure 8. Gate–To–Source and Drain–To–Source
Voltage versus Total Charge
I S
,SOURCE
CURRENT
(AMPS)
Figure 9. Resistive Switching Time
Variation versus Gate Resistance
RG, GATE RESISTANCE (OHMS)
1
10
100
t,
TIME
(ns)
VDD = 30 V
ID = 1.7 A
VGS = 10 V
TJ = 25°C
tf
td(off)
VGS = 0 V
TJ = 25°C
0
QT, TOTAL CHARGE (nC)
24
6
8
ID = 1.7 A
TJ = 25°C
VGS
0
1.2
1.6
2
1000
100
10
1
10
6
2
0
1
8
4
30
27
24
21
18
15
0
VDS
14
0.8
0.6
0.7
0.75
0.4
0.8
QT
Q1
Q2
Q3
10
12
td(on)
tr
Figure 10. Diode Forward Voltage versus Current
7
3
9
5
12
3
6
9
1
1.4
1.8
0.6
0.2
0.9
SAFE OPERATING AREA
The Forward Biased Safe Operating Area curves define
the maximum simultaneous drain–to–source voltage and
drain current that a transistor can handle safely when it is
forward biased. Curves are based upon maximum peak
junction temperature and a case temperature (TC) of 25°C.
Peak repetitive pulsed power limits are determined by using
the thermal response data in conjunction with the procedures
discussed
in
AN569,
“Transient
Thermal
Resistance–General Data and Its Use.”
Switching between the off–state and the on–state may
traverse any load line provided neither rated peak current
(IDM) nor rated voltage (VDSS) is exceeded and the
transition time (tr,tf) do not exceed 10 s. In addition the total
power averaged over a complete switching cycle must not
exceed (TJ(MAX) – TC)/(R
θJC).
A Power MOSFET designated E–FET can be safely used
in switching circuits with unclamped inductive loads. For
reliable operation, the stored energy from circuit inductance
dissipated in the transistor while in avalanche must be less
than the rated limit and adjusted for operating conditions
differing from those specified. Although industry practice is
to rate in terms of energy, avalanche energy capability is not
a constant. The energy rating decreases non–linearly with an
increase of peak current in avalanche and peak junction
temperature.
Although many E–FETs can withstand the stress of
drain–to–source avalanche at currents up to rated pulsed
current (IDM), the energy rating is specified at rated
continuous current (ID), in accordance with industry
custom. The energy rating must be derated for temperature
as shown in the accompanying graph (Figure 13). Maximum
energy at currents below rated continuous ID can safely be
assumed to equal the values indicated.
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