參數(shù)資料
型號(hào): MJF6668
廠商: ON SEMICONDUCTOR
元件分類: 功率晶體管
英文描述: COMPLEMENTARY SILICON POWER DARLINGTONS
中文描述: 10 A, 100 V, PNP, Si, POWER TRANSISTOR, TO-220AB
封裝: CASE 221D-03, TO-220, FULL PACK-3
文件頁數(shù): 7/8頁
文件大小: 338K
代理商: MJF6668
7
Motorola Bipolar Power Transistor Device Data
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
0.110” MIN
Figure 14. Clip Mounting Position
for Isolation Test Number 1
* Measurement made between leads and heatsink with all leads shorted together
CLIP
CLIP
0.107” MIN
LEADS
HEATSINK
0.107” MIN
Figure 15. Clip Mounting Position
for Isolation Test Number 2
Figure 16. Screw Mounting Position
for Isolation Test Number 3
MOUNTED
FULLY ISOLATED
PACKAGE
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
TEST CONDITIONS FOR ISOLATION TESTS*
4–40 SCREW
PLAIN WASHER
HEATSINK
COMPRESSION WASHER
NUT
CLIP
HEATSINK
Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw
torque of 6 to 8 in
.
lbs is sufficient to provide maximum power dissipation capability. The compression washer helps to maintain a con-
stant pressure on the package over time and during large temperature excursions.
Destructive laboratory tests show that using a hex head 4–40 screw, without washers, and applying a torque in excess of 20 in
.
lbs will
cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability.
Additional tests on slotted 4–40 screws indicate that the screw slot fails between 15 to 20 in
.
lbs without adversely affecting the pack-
age. However, in order to positively ensure the package integrity of the fully isolated device, Motorola does not recommend exceeding 10
in
.
lbs of mounting torque under any mounting conditions.
Figure 17. Typical Mounting Techniques*
MOUNTING INFORMATION
**For more information about mounting power semiconductors see Application Note AN1040.
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