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參數(shù)資料
| 型號(hào)： | MGSF3441V |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 小信號(hào)晶體管 |
| 英文描述： | 3300 mA, 20 V, P-CHANNEL, Si, SMALL SIGNAL, MOSFET |
| 封裝： | PLASTIC, TSOP-6 |
| 文件頁數(shù)： | 2/35頁 |
| 文件大?。?/td> | 358K |
| 代理商： | MGSF3441V |
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Packaging Specifications
6–6
Motorola Small–Signal Transistors, FETs and Diodes Device Data
TO–92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
H2A
H
F1
F2
P2
P1
P
D
W
W1
L1
W2
H2B
T1
T
T2
H4 H5
H1
Figure 1. Device Positioning on Tape
L
Specification
Inches
Millimeter
Symbol
Item
Min
Max
Min
Max
D
Tape Feedhole Diameter
0.1496
0.1653
3.8
4.2
D2
Component Lead Thickness Dimension
0.015
0.020
0.38
0.51
F1, F2
Component Lead Pitch
0.0945
0.110
2.4
2.8
H
Bottom of Component to Seating Plane
.059
.156
1.5
4.0
H1
Feedhole Location
0.3346
0.3741
8.5
9.5
H2A
Deflection Left or Right
0
0.039
0
1.0
H2B
Deflection Front or Rear
0
0.051
0
1.0
H4
Feedhole to Bottom of Component
0.7086
0.768
18
19.5
H5
Feedhole to Seating Plane
0.610
0.649
15.5
16.5
L
Defective Unit Clipped Dimension
0.3346
0.433
8.5
11
L1
Lead Wire Enclosure
0.09842
—
2.5
—
P
Feedhole Pitch
0.4921
0.5079
12.5
12.9
P1
Feedhole Center to Center Lead
0.2342
0.2658
5.95
6.75
P2
First Lead Spacing Dimension
0.1397
0.1556
3.55
3.95
T
Adhesive Tape Thickness
0.06
0.08
0.15
0.20
T1
Overall Taped Package Thickness
—
0.0567
—
1.44
T2
Carrier Strip Thickness
0.014
0.027
0.35
0.65
W
Carrier Strip Width
0.6889
0.7481
17.5
19
W1
Adhesive Tape Width
0.2165
0.2841
5.5
6.3
W2
Adhesive Tape Position
.0059
0.01968
.15
0.5
NOTES:
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements established in Figures 5, 6 and 7.
4. Maximum non–cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.
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PDF描述 |
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| MGSF3442X | 1700 mA, 20 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET |
| MGSF3454VT1 | 4.2 A, 30 V, 0.065 ohm, N-CHANNEL, Si, POWER, MOSFET |
| MGSF3454V | 4.2 A, 30 V, 0.065 ohm, N-CHANNEL, Si, POWER, MOSFET |
| MGSF3454XT1 | 1750 mA, 30 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET |
| MGSF3454X | 1750 mA, 30 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MGSF3441VT1 | 制造商:ON Semiconductor 功能描述:Trans MOSFET P-CH 20V 3.3A 6-Pin TSOP T/R 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| MGSF3441VTD | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Low rDS(on) Small-signal MOSFETs TMOS Single P=Channel Field Effect Transistors |
| MGSF3441XT1 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Low rDS(on) Small-Signal MOSFETs TMOS Single P-Channel Field Effect Transistors |
| MGSF3441XT3 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Low rDS(on) Small-Signal MOSFETs TMOS Single P-Channel Field Effect Transistors |
| MGSF3442VT1 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:N-CHANNEL ENHANCEMENT-MODE TMOS MOSFET |
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