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參數(shù)資料
| 型號： | MCZ33993EWR2 |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 23/28頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MULTIPLE SWITCH DETECT 32SOIC |
| 標準包裝： | 1,000 |
| 系列： | * |
| 應用： | * |
| 接口： | * |
| 電源電壓： | * |
| 封裝/外殼： | 32-SOIC（0.295"，7.50mm 寬） |
| 供應商設備封裝： | 32-SOIC |
| 包裝： | 帶卷 (TR) |
| 安裝類型： | 表面貼裝 |
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Analog Integrated Circuit Device Data
4
Freescale Semiconductor
33993
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ARCHIVE
INFORMATION
ARCHIVE
INFORMATION
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
VDD Supply Voltage
–
-0.3 to 7.0
VDC
CS,
SI, SO, SCLK, INT, AMUX (1)
–
-0.3 to 7.0
VDC
WAKE (1)
–
-0.3 to 40
VDC
VPWR Supply Voltage
–
-0.3 to 50
VDC
Switch Input Voltage Range
–
-14 to 40
VDC
Frequency of SPI Operation (VDD = 5.0 V)
–
6.0
MHz
ESD Voltage (2)
Human Body Model
Machine Model
VESD1
±4000
±200
V
THERMAL RATINGS
Storage Temperature
TSTG
-55 to 150
°C
Operating Case Temperature
TC
-40 to 125
°C
Operating Junction Temperature
TJ
-40 to 150
°C
THERMAL RESISTANCE
PD
1.7
W
Thermal Resistance
Junction to Ambient
Junction to Lead
RθJA
RθJL
74
25
°C/W
TPPRT
°C
Notes
1.
Exceeding these limits may cause malfunction or permanent damage to the device.
2.
ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω), the Machine Model (MM)
(CZAP = 200 pF, RZAP = 0 Ω), and the Charge Device Model (CDM), Robotic (CZAP = 4.0pF).
3.
Maximum power dissipation at TJ =150°C junction temperature with no heat sink used.
4.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
5.
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