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參數(shù)資料
| 型號： | MCRF355 |
| 廠商： | Microchip Technology Inc. |
| 英文描述： | CONNECTEUR |
| 中文描述： | 13.56 MHz無源RFID器件的防沖突功能 |
| 文件頁數(shù)： | 16/23頁 |
| 文件大?。?/td> | 568K |
| 代理商： | MCRF355 |
MCRF355/360
DS21287F-page 16
2002 Microchip Technology Inc.
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
4
12
12
.017
.009
.025
.015
.193
.154
.237
.007
.056
.061
.050
8
Foot Angle
Lead Thickness
φ
c
0
8
0
4
8
15
12
0
15
0
β
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
15
12
0
15
0
α
Mold Draft Angle Top
.51
.42
.33
.020
.013
B
Lead Width
.25
.23
.20
.010
.008
.76
.62
.48
.030
.019
L
Foot Length
.51
.38
.25
.020
.010
h
Chamfer Distance
5.00
4.90
4.80
.197
.189
D
Overall Length
3.99
3.91
3.71
.157
.146
E1
Molded Package Width
6.20
6.02
5.79
.244
.228
E
Overall Width
.25
.18
.10
.010
.004
A1
Standoff
§
1.55
1.42
1.32
.061
.052
A2
Molded Package Thickness
1.75
1.55
1.35
.069
.053
A
Overall Height
1.27
p
Pitch
8
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
DIMENSION LIMITS
MILLIMETERS
INCHES*
UNITS
2
1
D
n
p
B
E
E1
h
L
β
c
45°
φ
A2
α
A
A1
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
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PDF描述 |
|---|---|
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| MDF27A-1822P | Crimping Contact Directly Mounted on Board |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MCRF360 | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:13.56 MHz Passive RFID Device with Anti-Collision Feature |
| MCRF450 | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:13.56 MHz Read/Write Passive RFID Device |
| MCRF451 | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:13.56 MHz Read/Write Passive RFID Device |
| MCRF452 | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:13.56 MHz Read/Write Passive RFID Device |
| MCRF455 | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:13.56 MHz Read/Write Passive RFID Device |
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