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參數(shù)資料
| 型號： | MCRF355 |
| 廠商： | Microchip Technology Inc. |
| 英文描述： | CONNECTEUR |
| 中文描述： | 13.56 MHz無源RFID器件的防沖突功能 |
| 文件頁數(shù)： | 12/23頁 |
| 文件大小： | 568K |
| 代理商： | MCRF355 |
MCRF355/360
DS21287F-page 12
2002 Microchip Technology Inc.
5.0
FAILED DIE IDENTIFICATION
Every die on the wafer is electrically tested according
to the data sheet specifications and visually inspected
to detect any mechanical damage, such as mechanical
cracks and scratches.
Any failed die in the test or visual inspection is identified
by black colored ink. Therefore, any die covered with
black ink should not be used.
The ink dot specification:
Ink dot size: 254
μ
m in circular diameter
Position: central third of die
Color: black
6.0
WAFER DELIVERY
DOCUMENTATION
The wafer is shipped with the following information:
Microchip Technology Inc. MP Code
Lot Number
Total number of wafers in the container
Total number of good dice in the container
Average die per wafer (DPW)
Scribe number of wafers with number of good
dice
7.0
NOTICE ON DIE AND WAFER
HANDLING
The device is very susceptible to Electro-Static Dis-
charge (ESD), which can cause a critical damage to the
device. Special attention is needed during the handling
process.
Any ultraviolet (UV) light can erase the memory cell
contents of an unpackaged device. Fluorescent lights
and sunlight can also erase the memory cell, although
it takes more time than UV lamps. Therefore, keep any
unpackaged device out of UV light and also avoid direct
exposure of strong fluorescent lights and shining
sunlight.
Certain IC manufacturing, COB and tag assembly
operations may use UV light. Operations such as back-
grind de-tape, certain cleaning procedures, epoxy or
glue cure should be done without exposing the die
surface to UV light.
Using X-ray for die inspection will not harm the die, nor
erase memory cell contents.
8.0
REFERENCES
It is recommended that the reader reference the
following documents.
1.
“Antenna Circuit Design for RFID Applications”,
AN710, DS00710.
2.
“RFID Tag and COB Development Guide with
Microchip’s RFID Devices”, AN830, DS00830.
3.
“MCRF355/360 Application Note: Mode of
Operation and External Resonance Circuit”,
AN707, DS00707.
4.
“Microchip Development Kit Sample Format for
the MCRF355/360 Devices”, TB031, DS91031.
5.
“MCRF355/360 Reader Reference Design”,
DS21311.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MCRF360 | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:13.56 MHz Passive RFID Device with Anti-Collision Feature |
| MCRF450 | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:13.56 MHz Read/Write Passive RFID Device |
| MCRF451 | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:13.56 MHz Read/Write Passive RFID Device |
| MCRF452 | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:13.56 MHz Read/Write Passive RFID Device |
| MCRF455 | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:13.56 MHz Read/Write Passive RFID Device |
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