Package Information and Pinout
MCIMX31/MCIMX31L Technical Data, Rev. 4.1
Freescale Semiconductor
105
5
Package Information and Pinout
This section includes the contact assignment information and mechanical package drawing for the
MCIMX31.
5.1
MAPBGA Production Package—457 14 x 14 mm, 0.5 mm Pitch
× 14 MAPBGA signal assignments), and MAPBGA ground/power ID by ball
grid location for the 457 14 x 14 mm, 0.5 mm pitch package.
5.1.1
Production Package Outline Drawing–
14 x 14 mm 0.5 mm
Figure 86. Production Package: Case 1581—0.5 mm Pitch
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
i.MX31
Product
Family