參數(shù)資料
型號: MC8641VU1333JE
廠商: Freescale Semiconductor
文件頁數(shù): 118/130頁
文件大?。?/td> 0K
描述: IC MPU SGL CORE E600 1023FCCBGA
標(biāo)準(zhǔn)包裝: 1
系列: MPC86xx
處理器類型: 32-位 MPC86xx PowerPC
速度: 1.333GHz
電壓: 1.05V
安裝類型: 表面貼裝
封裝/外殼: 994-BCBGA,F(xiàn)CCBGA
供應(yīng)商設(shè)備封裝: 994-FCCBGA(33x33)
包裝: 托盤
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 2
88
Freescale Semiconductor
Package
16 Package
This section details package parameters and dimensions.
16.1
Package Parameters for the MPC8641
The package parameters are as provided in the following list. The package type is 33 mm
× 33 mm, 1023
pins. There are two package options: high-lead Flip Chip-Ceramic Ball Grid Array (FC-CBGA), and
lead-free (FC-CBGA).
For all package types:
Die size
12.1 mm
× 14.7 mm
Package outline
33 mm
× 33 mm
Interconnects
1023
Pitch
1 mm
Total Capacitor count
43 caps; 100 nF each
For high-lead FC-CBGA (package option: HCTE1 HX)
Maximum module height
2.97 mm
Minimum module height
2.47 mm
Solder Balls
89.5% Pb 10.5% Sn
Ball diameter (typical2)
0.60 mm
For RoHS lead-free FC-CBGA (package option: HCTE1 VU)
Maximum module height
2.77 mm
Minimum module height
2.27 mm
Solder Balls
95.5% Sn 4.0% Ag 0.5% Cu
Ball diameter (typical2)
0.60 mm
1 High-coefficient of thermal expansion
2 Typical ball diameter is before reflow
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