參數(shù)資料
型號: MC860SRCZQ50D4R2
廠商: Freescale Semiconductor
文件頁數(shù): 73/78頁
文件大?。?/td> 0K
描述: IC MPU POWERQUICC 50MHZ 357-PBGA
標準包裝: 180
系列: MPC8xx
處理器類型: 32-位 MPC8xx PowerQUICC
速度: 50MHz
電壓: 3.3V
安裝類型: 表面貼裝
封裝/外殼: 357-BBGA
供應商設(shè)備封裝: 357-PBGA(25x25)
包裝: 帶卷 (TR)
MPC860 PowerQUICC Family Hardware Specifications, Rev. 9
Freescale Semiconductor
75
Mechanical Data and Ordering Information
Figure 78 shows the mechanical dimensions of the ZQ PBGA package.
Figure 78. Mechanical Dimensions and Bottom Surface Nomenclature of the ZQ PBGA Package
NOTE
1.
All Dimensions in millimeters.
2.
Dimensions and tolerance per ASME Y14.5M, 1994.
3.
Maximum Solder Ball Diameter measured parallel to Datum A.
4.
Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
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