- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄3971 > MC860SRCZQ50D4R2 (Freescale Semiconductor)IC MPU POWERQUICC 50MHZ 357-PBGA PDF資料下載
參數(shù)資料
| 型號(hào)： | MC860SRCZQ50D4R2 |
| 廠商： | Freescale Semiconductor |
| 文件頁(yè)數(shù)： | 5/78頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU POWERQUICC 50MHZ 357-PBGA |
| 標(biāo)準(zhǔn)包裝： | 180 |
| 系列： | MPC8xx |
| 處理器類型： | 32-位 MPC8xx PowerQUICC |
| 速度： | 50MHz |
| 電壓： | 3.3V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 357-BBGA |
| 供應(yīng)商設(shè)備封裝： | 357-PBGA（25x25） |
| 包裝： | 帶卷 (TR) |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)當(dāng)前第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)
MPC860 PowerQUICC Family Hardware Specifications, Rev. 9
Freescale Semiconductor
13
Thermal Calculation and Measurement
Figure 2. Effect of Board Temperature Rise on Thermal Behavior
If the board temperature is known, an estimate of the junction temperature in the environment can be made
using the following equation:
TJ = TB + (RθJB × PD)
where:
RθJB = junction-to-board thermal resistance (C/W)
TB = board temperature (C)
PD = power dissipation in package
If the board temperature is known and the heat loss from the package case to the air can be ignored,
acceptable predictions of junction temperature can be made. For this method to work, the board and board
mounting must be similar to the test board used to determine the junction-to-board thermal resistance,
namely a 2s2p (board with a power and a ground plane) and by attaching the thermal balls to the ground
plane.
7.4
Estimation Using Simulation
When the board temperature is not known, a thermal simulation of the application is needed. The simple
two-resistor model can be used with the thermal simulation of the application [2], or a more accurate and
complex model of the package can be used in the thermal simulation.
7.5
Experimental Determination
To determine the junction temperature of the device in the application after prototypes are available, the
thermal characterization parameter (
ΨJT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT × PD)
Board Temperature Rise Above Ambient Divided by Package Power
Jun
c
ti
o
n
T
e
m
p
er
at
ur
e
R
ise
A
b
ove
A
m
bi
en
t
D
ivi
de
d
b
y
P
a
c
k
a
g
e
P
o
w
e
r
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MC850DECZQ50BUR2 | IC MPU PQUICC 50MHZ 256-PBGA |
| IDT70V639S12BCI8 | IC SRAM 2.25MBIT 12NS 256BGA |
| MC850DECVR50BUR2 | IC MPU PQUICC 50MHZ 256-PBGA |
| IDT7008S55G | IC SRAM 512KBIT 55NS 84PGA |
| XF2B-3145-31A | CONN FPC 31POS 0.3MM PITCH SMD |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC861 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:INTEGRATED CIRCUITS |
| MC8610PX1066JB | 功能描述:微處理器 - MPU REV 1.1 8610 1.0V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MC8610PX1066JZ | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:MPC8610 Integrated Host Processor Hardware Specifications |
| MC8610PX1067G | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MC8610PX1067J | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。