參數(shù)資料
型號： MC68HC05C9AP
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 8-BIT, MROM, 2.1 MHz, MICROCONTROLLER, PDIP40
封裝： PLASTIC, DIP-40
文件頁數(shù)： 43/160頁
文件大小： 4128K
代理商： MC68HC05C9AP
Mechanical Specifications
44-Lead Plastic Leaded Chip Carrier (PLCC) (Case 777-02)
MC68HC05C9A — Rev. 4.0
General Release Specification
Mechanical Specifications
NON-DISCLOSURE
AGREEMENT
REQUIRED
13.5 44-Lead Plastic Leaded Chip Carrier (PLCC) (Case 777-02)
Figure 13-3. 44-Lead PLCC (Case 777-02)
-N-
-L-
-M-
D
Y
D
K
V
W
1
44
BRK
B
Z
U
X
VIEW D-D
S
L-M
M
0.007(0.180)
N S
T
S
L-M
M
0.007(0.180)
N S
T
G1
S
L-M
S
0.010 (0.25)
N S
T
K1
F
H
S
L-M
M
0.007(0.180)
N S
T
Z
G
G1
R
A
E
J
VIEW S
C
S
L-M
M
0.007(0.180)
N S
T
S
L-M
M
0.007(0.180)
N S
T
0.004 (0.10)
-T- SEATING
PLANE
VIEW S
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.685
0.695
17.40
17.65
B
0.685
0.695
17.40
17.65
C
0.165
0.180
4.20
4.57
E
0.090
0.110
2.29
2.79
F
0.013
0.019
0.33
0.48
G
0.050 BSC
1.27 BSC
H
0.026
0.032
0.66
0.81
J
0.020
0.51
K
0.025
0.64
R
0.650
0.656
16.51
16.66
U
0.650
0.656
16.51
16.66
V
0.042
0.048
1.07
1.21
W
0.042
0.048
1.07
1.21
X
0.042
0.056
1.07
1.42
Y
0.020
0.50
Z
2
°
10
°
G1
0.610
0.630
15.50
16.00
K1
0.040
1.02
S
L-M
S
0.010 (0.25)
N S
T
S
L-M
M
0.007(0.180)
N S
T
2
°
10
°
NOTES:
1. DATUMS -L-, -M-, AND -N- ARE DETERMINED
WHERE TOP OF LEAD SHOLDERS EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM -T-, SEATING PLANE.
3. DIMENSION R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.25) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE DETER-
MINED
AT THE OUTERMOST EXTREMES OF THE
PLASTIC BODY EXCLUSIVE OF THE MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND
INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM
OF THE PLASTIC BODY.
7. DIMINSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTUSION(S) SHALL NOT CAUSE THE H
DIMINSION TO BE GREATER THAN 0.037
(0.940138). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMINISION TO SMALLER
THAN 0.025 (0.635).
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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