參數(shù)資料
型號(hào): MB86064
廠商: FUJITSU LTD
元件分類: DAC
英文描述: Dual 14-bit 1GSa/s DAC
中文描述: PARALLEL, WORD INPUT LOADING, 14-BIT DAC, PBGA120
封裝: 12 X 12 MM, PLASTIC, EFBGA-120
文件頁(yè)數(shù): 1/4頁(yè)
文件大?。?/td> 123K
代理商: MB86064
MB86064
Copyright 2004 Fujitsu Microelectronics Europe GmbH
Production
Page 1 of 4
Disclaimer:
The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before
ordering.The information and circuit diagrams in this document are presented “as is”, no license is granted by implication or otherwise.
Product Flyer
October 2004
Version 1.1
FME/MS/DAC80/FL/5085
Dual 14-bit 1GSa/s DAC
Mixed Signal Division
The Fujitsu MB86064 is a Dual 14-bit 1GSa/s digital to analog
converter (DAC), delivering exceptional dynamic performance.
Each high performance DAC core is capable of generating
multi-standard, multi-carrier communication transmit signals,
suitable for 2, 2.5 and 3G systems. DAC data is input via two
high-speed LVDS ports. These operate in a pseudo double data
rate (DDR) mode, with data latched on both rising and falling
edges. Alternatively, the device can be configured as a
multiplexed dual-port single DAC. To simplify system
integration the DAC operates from a clock running at half the
DAC conversion rate.
Features
Dual 14-bit, 1GSa/s Digital to Analog conversion
Exceptional dynamic performance
74dBc ACLR for 4 UMTS carriers @ 276MHz direct-IF
100MHz image-free generated bandwidth capability
supports UMTS plus digital pre-distortion bandwidth
Proprietary performance enhancement features
LVDS data interface
Register selectable on-chip LVDS termination resistors
Fujitsu 4-wire serial control interface
Two 16k point programmable on-chip waveform memories
Low power 3.3V analog and 1.8V digital operation
750mW per DAC power dissipation at 1GSa/s
0.18μm CMOS technology with Triple Well
Performance enhanced EFBGA package
Industrial temperature range (-40°C to +85°C)
Applications
Multi-carrier, Multi-standard cellular infrastructure
CDMA, W-CDMA, GSM/EDGE, UMTS
Wideband communications systems
High Direct-IF architectures
Arbitrary waveform generation
Test equipment
Radar, video & display systems
PLASTIC PACKAGE
EFBGA-120
Package Dimensions
12 mm x 12 mm
PIN ASSIGNMENT
Not to scale. Viewed fromabove.
E3
E1
F4
F2
G3
G1
H4
H2
J3
J1
K4
K2
L3
L1
M4
M2
N3
N1
P4
P2
R3
R1
T4
T2
U3
V2
W3
W1
AA5
AC5
Y6
AB6
AA7
AC7
Y8
AB8
AA9
AC9
Y10
AB10
AA11
AC11
Y12
AB12
AA13
AC13
Y14
AB14
AA15
AC15
Y16
AB16
AA17
AC17
Y18
AB18
AA19
AC19
W21
W23
V20
V22
U21
U23
T20
T22
R21
R23
P20
P22
N21
N23
M20
M22
L21
L23
K20
K22
J 21
J 23
H20
H22
G21
G23
F20
F22
E21
E23
C19
A19
D18
B18
C17
A17
B16
D16
A15
C15
B14
D14
A13
C13
B12
D12
A11
C11
B10
D10
A9
C9
B8
A7
C7
D8
B6
D6
A5
C5
Index
N10
N12
N14
R10
R12
R14
L10
L12
L14
J10
J 12
J14
K9
K11
K13
K15
M9
M11
M13
M15
P9
P11
P13
P15
S
S
A
I
I
A
B
A
A
A
I
I
A
D
S
C
C
V
A
A
X
T
V
X_A10
A10
DVSS
X_A8
V
R
A
S
S
A
A
DVSS
DVDD
DVDD
A8
X_A6
A6
DVSS
X_A3
A3
X_A1
A2
X_A2
A4
DVDD
X_A4
X_B9
B9
DVDD
X_B7
X_B10
B10
DVSS
X_B8
DVDD
X_B4
B4
DVSS
X_B3
DVDD
DVDD
DVSS
DVSS
A1
DVSS
NC
NC
A5
X_A5
A7
X_A7
DVDD
A9
X_A9
B
X
D
L
A
X
L
X
X
D
X
A
C
A
D
X
X
X
A
B
D
X
X
C
D
X
D
B
B
X
B6
X_B6
B8
B2
X_B2
B1
B3
B5
NC
NC
X_B1
X_B5
B7
U1
V4
All centre pins : TG
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