MAX3886
Power Supply and Ground Connection
The MAX3886 has six VCC connection pads, and instal-
lation of a bypass capacitor at each VCC pad is recom-
mended. All six VCC connections should be driven from
the same source to eliminate the possibility of indepen-
dent power-supply sequencing. Pin 53 provides current
directly to the internal VCO stage; excessive supply
noise at this node can result in increased jitter.
The 56-pin TQFN package features an exposed pad
(EP) that provides a low resistance thermal path for
heat removal from the IC and must be connected to the
circuit board ground plane for proper operation. The EP
also provides essential electrical ground connectivity.
Multirate CDR with Integrated Serializer/Deserializer
for GPON and BPON ONT Applications
16
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TOP VIEW
MAX3886
THIN QFN
(8mm
脳 8mm 脳 0.8mm)
15
17
16
18
19
20
21
22
23
24
25
26
27
28
GND
PCKI+
PCKI-
PDI3+
PDI3-
PDI2+
PDI2-
PDI1+
PDI1-
PDI0+
PDI0-
BENI+
BENI-
VCC
GND
TP4
CFIL
VCC
LOCK
MVCO
MSYM
MDDR
RFCK1
RFCK2
VCC
FRST
FERR
GND
48
47
46
45
44
43
54
53
56
55
52
51
50
49
1
2
3
4
5
6
7
8
9
10
11 121314
42 41 40 39 38 37 36 35 34 33 32 31 30 29
V
CC
TP3
GND
SDO+
SDO-
TP2
BENO+
BENO-
V
CC
SDI-
SDI+
V
CC
TP1
GND
RCKO-
RCKO+
GND
PDO3+
PDO3-
PDO2+
PDO2-
PDO1+
PDO1-
PDO0+
PDO0-
PCKO+
PCKO-
GND
+
EP*
* THE EXPOSED PAD OF THE THIN QFN PACKAGE MUST BE SOLDERED TO GROUND FOR PROPER
THERMAL AND ELECTRICAL OPERATION.
Pin Configuration