參數(shù)資料
型號(hào)： M24C01-RMB3T/S
廠商： STMICROELECTRONICS
元件分類： PROM
英文描述： 128 X 8 I2C/2-WIRE SERIAL EEPROM, DSO8
封裝： 2 X 3 MM, MLP-8
文件頁(yè)數(shù)： 25/33頁(yè)
文件大?。?/td> 278K
代理商： M24C01-RMB3T/S
M24C16, M24C08, M24C04, M24C02, M24C01
Revision history
9
Revision history
Table 21.
Document revision history
Date
Version
Changes
10-Dec-1999
2.4
TSSOP8 Turned-Die package removed (p 2 and order information)
Lead temperature added for TSSOP8 in table 2
18-Apr-2000
2.5
Labelling change to Fig-2D, correction of values for ‘E’ and main caption for
Tab-13
05-May-2000
2.6
Extra labelling to Fig-2D
23-Nov-2000
3.0
SBGA package information removed to an annex document
-R range changed to being the -S range, and the new -R range added
19-Feb-2001
3.1
SBGA package information put back in this document
Lead Soldering Temperature in the Absolute Maximum Ratings table
amended
Write Cycle Polling Flow Chart using ACK illustration updated
References to PSDIP changed to PDIP and Package Mechanical data
updated
Wording brought in to line with standard glossary
20-Apr-2001
3.2
Revision of DC and AC characteristics for the -S series
08-Oct-2001
3.3
Ball numbers added to the SBGA connections and package mechanical
illustrations
09-Nov-2001
3.4
Specification of Test Condition for Leakage Currents in the DC
Characteristics table improved
30-Jul-2002
3.5
Document reformatted using new template. SBGA5 package removed
TSSOP8 (3x3mm body size) package (MSOP8) added. -L voltage range
added
04-Feb-2003
3.6
Document title spelt out more fully. “W”-marked devices with tw=5ms
added.
05-May-2003
3.7
-R voltage range upgraded to 400kHz working, and no longer preliminary
data.
5V voltage range at temperature range 3 (-xx3) no longer preliminary data.
-S voltage range removed. -Wxx3 voltage+temp ranged added as
preliminary data.
07-Oct-2003
4.0
Table of contents, and Pb-free options added. Minor wording changes in
Summary Description, Power-On Reset, Memory Addressing, Read
Operations. VIL(min) improved to
-0.45V. tW(max) value for -R voltage range corrected.
17-Mar-2004
5.0
MLP package added. Absolute Maximum Ratings for VIO(min) and
VCC(min) changed. Soldering temperature information clarified for RoHS
compliant devices. Device grade information clarified. Process
identification letter “G” information added. 2.2-5.5V range is removed, and
4.5-5.5V range is now Not for New Design
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