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參數(shù)資料
| 型號： | M24C01-RMB3T/S |
| 廠商： | STMICROELECTRONICS |
| 元件分類： | PROM |
| 英文描述： | 128 X 8 I2C/2-WIRE SERIAL EEPROM, DSO8 |
| 封裝： | 2 X 3 MM, MLP-8 |
| 文件頁數(shù)： | 10/33頁 |
| 文件大?。?/td> | 278K |
| 代理商： | M24C01-RMB3T/S |
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Initial delivery state
M24C16, M24C08, M24C04, M24C02, M24C01
4
Initial delivery state
The device is delivered with all bits in the memory array set to 1 (each byte contains FFh).
5
Maximum rating
Stressing the device outside the ratings listed in Table 5 may cause permanent damage to
the device. These are stress ratings only, and operation of the device at these, or any other
conditions outside those indicated in the Operating sections of this specification, is not
implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect
device reliability. Refer also to the STMicroelectronics SURE Program and other relevant
quality documents.
1.
TLEAD max must not be applied for more than 10s.
2.
AEC-Q100-002 (compliant with JEDEC Std JESD22-A114A, C1=100pF, R1=1500
, R2=500).
Table 5.
Absolute maximum ratings
Symbol
Parameter
Min.
Max.
Unit
TA
Ambient Operating Temperature
–40
130
°C
TSTG
Storage Temperature
–65
150
°C
TLEAD
Lead Temperature during Soldering
see note (1)
1.
Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the ST ECOPACK
7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS)
2002/95/EU.
°C
PDIP-Specific Lead Temperature during Soldering
260(2)
2.
TLEAD max must not be applied for more than 10s.
°C
VIO
Input or Output range
–0.50
6.5
V
VCC
Supply Voltage
–0.50
6.5
V
VESD
Electrostatic Discharge Voltage (Human Body model)
(2)
–4000
4000
V
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