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參數(shù)資料
| 型號： | LTVA |
| 廠商： | Linear Technology Corporation |
| 英文描述： | 1-/2-Channel 20-Bit UPower No Latency ADCs in MSOP-10 |
| 中文描述： | 1-/2-Channel 20位ADC的無延遲UPower采用MSOP - 10 |
| 文件頁數(shù)： | 31/32頁 |
| 文件大?。?/td> | 375K |
| 代理商： | LTVA |
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31
LTC2421/LTC2422
24212f
PACKAGE IU
U
W
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
MSOP (MS) 1001
0.53
±
0.01
(.021
±
.006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
0.13
±
0.05
(.005
±
.002)
0.86
(.034)
REF
0.50
(.0197)
TYP
1 2 3 4 5
4.88
±
0.10
(.192
±
.004)
0.497
±
0.076
(.0196
±
.003)
REF
8
9
10
7 6
3.00
±
0.102
(.118
±
.004)
(NOTE 3)
3.00
±
0.102
(.118
±
.004)
NOTE 4
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0
°
– 6
°
TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
0.889
±
0.127
(.035
±
.005)
RECOMMENDED SOLDER PAD LAYOUT
3.05
±
0.38
(.0120
±
.0015)
TYP
0.50
(.0197)
BSC
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