參數(shù)資料
型號(hào): LPC2364FBD100
廠商: NXP Semiconductors N.V.
元件分類: 數(shù)學(xué)處理器
英文描述: ARM7 with 128 kB flash, 34 kB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC
封裝: LPC2364FBD100<SOT407-1 (LQFP100)|<<http://www.nxp.com/packages/SOT407-1.html<1<Always Pb-free,;
文件頁(yè)數(shù): 48/69頁(yè)
文件大?。?/td> 517K
代理商: LPC2364FBD100
LPC2364_65_66_67_68
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 7 — 20 October 2011
48 of 69
NXP Semiconductors
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
11. Dynamic characteristics
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25
C), nominal supply voltages.
[3]
LPC2364HBD only.
[4]
Bus capacitance C
b
in pF, from 10 pF to 400 pF.
Table 9.
T
amb
=
40
C to +85
C for standard devices,
40
C to +125
C for LPC2364HBD only, unless otherwise specified; V
DD(3V3)
over specified ranges.
[1]
Symbol
Parameter
Conditions
ARM processor clock frequency
f
oper
operating frequency
CCLK;
40
C to +85
C
CCLK; > 85
C
IRC;
40
C to +85
C
IRC; > 85
C
External clock
f
osc
oscillator frequency
T
cy(clk)
clock cycle time
t
CHCX
clock HIGH time
t
CLCX
clock LOW time
t
CLCH
clock rise time
t
CHCL
clock fall time
I
2
C-bus pins (P0[27] and P0[28])
t
f(o)
output fall time
V
IH
to V
IL
SSP interface
t
su(SPI_MISO)
SPI_MISO set-up time
T
amb
= 25
C; measured
in SPI Master mode; see
Figure 15
Dynamic characteristics
Min
Typ
[2]
Max
Unit
1
-
-
4
4.02
72
60
4.04
4.06
MHz
MHz
MHz
MHz
[3]
1
3.96
[3]
3.98
1
42
T
cy(clk)
0.4
T
cy(clk)
0.4
-
-
-
-
-
-
-
-
25
1000
-
-
5
5
MHz
ns
ns
ns
ns
ns
20 + 0.1
C
b
[4]
-
-
ns
-
11
-
ns
Fig 13. External clock timing (with an amplitude of at least V
i(RMS)
= 200 mV)
t
CHCL
t
CLCX
t
CHCX
t
CLCH
T
cy(clk)
002aaa907
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