參數(shù)資料
型號: KMPC8323ZQADDC
廠商: Freescale Semiconductor
文件頁數(shù): 6/82頁
文件大?。?/td> 0K
描述: IC MPU PWRQUICC II 516PBGA
標準包裝: 2
系列: MPC83xx
處理器類型: 32-位 MPC83xx PowerQUICC II Pro
速度: 266MHz
電壓: 1V
安裝類型: 表面貼裝
封裝/外殼: 516-BBGA
供應商設備封裝: 516-FPBGA(27x27)
包裝: 托盤
MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4
14
Freescale Semiconductor
DDR1 and DDR2 SDRAM
Table 14 provides the recommended operating conditions for the DDR1 SDRAM component(s) of the
MPC8323E when Dn_GVDD(typ) = 2.5 V.
Table 15 provides the DDR1 capacitance Dn_GVDD(typ) = 2.5 V.
Delta input/output capacitance: DQ, DQS
CDIO
—0.5
pF
1
Note:
1. This parameter is sampled. D
n
_GVDD = 1.8 V ± 0.090 V, f = 1 MHz, TA =25°C, VOUT = Dn_GVDD ÷ 2,
VOUT (peak-to-peak) = 0.2 V.
Table 14. DDR1 SDRAM DC Electrical Characteristics for D
n
_GVDD(typ) = 2.5 V
Parameter/Condition
Symbol
Min
Max
Unit
Notes
I/O supply voltage
D
n
_GVDD
2.375
2.625
V
1
I/O reference voltage
MVREF
nREF
0.49
× Dn_GVDD
0.51
× Dn_GVDD
V2
I/O termination voltage
VTT
MVREF
nREF – 0.04
MVREF
nREF + 0.04
V
3
Input high voltage
VIH
MVREF
nREF + 0.15
D
n
_GVDD + 0.3
V
Input low voltage
VIL
–0.3
MVREF
nREF – 0.15
V
Output leakage current
IOZ
–9.9
μA4
Output high current (VOUT = 1.95 V)
IOH
–16.2
mA
Output low current (VOUT = 0.35 V)
IOL
16.2
mA
Notes:
1. D
n
_GVDD is expected to be within 50 mV of the DRAM Dn_GVDD at all times.
2. MVREF
nREF is expected to be equal to 0.5 × Dn_GVDD, and to track Dn_GVDD DC variations as measured at the receiver.
Peak-to-peak noise on MVREF
nREF may not exceed ±2% of the DC value.
3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be
equal to MVREF
nREF. This rail should track variations in the DC level of MVREFnREF.
4. Output leakage is measured with all outputs disabled, 0 V
VOUT Dn_GVDD.
Table 15. DDR1 SDRAM Capacitance for D
n
_GVDD(typ) = 2.5 V Interface
Parameter/Condition
Symbol
Min
Max
Unit
Notes
Input/output capacitance: DQ,DQS
CIO
68
pF
1
Delta input/output capacitance: DQ, DQS
CDIO
—0.5
pF
1
Note:
1. This parameter is sampled. D
n
_GVDD = 2.5 V ± 0.125 V, f = 1 MHz, TA = 25° C, VOUT = Dn_GVDD ÷ 2,
VOUT (peak-to-peak) = 0.2 V.
Table 13. DDR2 SDRAM Capacitance for D
n
_GVDD(typ) = 1.8 V
相關PDF資料
PDF描述
KMPC8323EZQAFDC IC MPU PWRQUICC II 516PBGA
IDT70T3339S166BC IC SRAM 9MBIT 166MHZ 256BGA
IDT70T3339S166BF IC SRAM 9MBIT 166MHZ 208FBGA
IDT70T3799MS133BBG IC SRAM 9MBIT 133MHZ 324BGA
IDT70T3519S133BC IC SRAM 9MBIT 133MHZ 256BGA
相關代理商/技術參數(shù)
參數(shù)描述
KMPC8323ZQAFDC 功能描述:微處理器 - MPU 8323 PBGA W/O ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8343CVRAGDB 功能描述:微處理器 - MPU 8347 PBGA NOPB W/O ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8343CZQAGD 功能描述:IC MPU PWRQUICC II 620-PBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC83xx 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應商設備封裝:357-PBGA(25x25) 包裝:托盤
KMPC8343CZQAGDB 功能描述:微處理器 - MPU 8347 PBGA W/O ENC W/ PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8343ECVRAGDB 功能描述:微處理器 - MPU 8347 PBGA NOPB W/ ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324