參數(shù)資料
型號： KMC8610VT1333JB
廠商： Freescale Semiconductor
文件頁數(shù)： 86/96頁
文件大?。?/td> 0K
描述： IC HOST PROCESS 1333MHZ 783-PBGA
標(biāo)準(zhǔn)包裝： 1
系列： MPC86xx
處理器類型： 32-位 MPC86xx PowerPC
速度： 1.333GHz
電壓： 1.025V
安裝類型： 表面貼裝
封裝/外殼： 783-BBGA，F(xiàn)CBGA
供應(yīng)商設(shè)備封裝： 783-FCPBGA（29x29）
包裝： 托盤
Hardware Design Considerations
MPC8610 Integrated Host Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
87
Often, heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see Figure 54).
Therefore, synthetic grease offers the best thermal performance, considering the low interface pressure, and is recommended.
Of course, the selection of any thermal interface material depends on many factors—thermal performance requirements,
manufacturability, service temperature, dielectric properties, cost, and so on.
Figure 56. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials should be selected
based on high conductivity and mechanical strength to meet equipment shock/vibration requirements. There are several
commercially available thermal interfaces and adhesive materials provided by the following vendors:
The Bergquist Company
800-347-4572
18930 West 78
th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Corporate Center
PO Box 994
Midland, MI 48686-0994
Internet: www.dowcorning.com
Shin-Etsu MicroSi, Inc.
888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
0
0.5
1
1.5
2
0
1020
30
40
50607080
Silicone Sheet (0.006 in.)
Bare Joint
Fluoroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Spe
c
if
ic
Ther
m
a
lResi
st
anc
e
(K
-i
n.
2
/W
)
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