參數資料
型號： KMC755CVT400LE
廠商： Freescale Semiconductor
文件頁數： 40/56頁
文件大?。?/td> 0K
描述： IC MPU 32BIT 400MHZ 360-FCPBGA
標準包裝： 1
系列： MPC7xx
處理器類型： 32-位 MPC7xx PowerPC
速度： 400MHz
電壓： 2V
安裝類型： 表面貼裝
封裝/外殼： 360-BBGA，FCCBGA
供應商設備封裝： 360-FCCBGA（25x25）
包裝： 托盤
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
45
System Design Information
The board designer can choose between several types of heat sinks to place on the MPC755. There are
several commercially-available heat sinks for the MPC755 provided by the following vendors:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-749-7601
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC)818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Tyco Electronics
800-522-6752
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
8.8.1
Internal Package Conduction Resistance
For the exposed-die packaging technology, shown in Table 4, the intrinsic conduction thermal resistance
paths are as follows:
The die junction-to-case (or top-of-die for exposed silicon) thermal resistance
The die junction-to-ball thermal resistance
Figure 26 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Heat generated on the active side of the chip is conducted through the silicon, then through the heat sink
attach material (or thermal interface material), and finally to the heat sink where it is removed by forced-air
convection.
Since the silicon thermal resistance is quite small, for a first-order analysis, the temperature drop in the
silicon may be neglected. Thus, the heat sink attach material and the heat sink conduction/convective
thermal resistances are the dominant terms.
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