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參數(shù)資料
| 型號： | K4H560438E-ZLB3 |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | Connector Kit; Contents Of Kit:C14610G0245001 24 position hood PG 21 double latch low profile side entry, C14610A0241021 24 position male insert wire protect, VN162100014 PG 21 gland bushing, For 0.433" - 0.866" diameter cable RoHS Compliant: Yes |
| 中文描述： | 256Mb的電子芯片與DDR SDRAM的規(guī)格鉛60 FBGA封裝，免費（符合RoHS） |
| 文件頁數(shù)： | 22/26頁 |
| 文件大?。?/td> | 291K |
| 代理商： | K4H560438E-ZLB3 |
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- 22 -
DDR SDRAM
Rev. 2.2 Mar. ’03
K4H561638D
Notes 1. Includes
±
25mV margin for DC offset on V
REF
, and a combined total of
±
50mV margin for all AC noise and DC offset on
V
REF
, bandwidth limited to 20MHz. The DRAM must accommodate DRAM current spikes on V
REF
and internal DRAM noise
coupled TO V
REF
, both of which may result in V
REF
noise. V
REF
should be de-coupled with an inductance of
≤
3nH.
2. V
TT
is not applied directly to the device. V
TT
is a system supply for signal termination resistors, is expected to be set equal to
V
REF
, and must track variations in the DC level of V
REF
3. V
ID
is the magnitude of the difference between the input level on CK and the input level on CK.
4. These parameters should be tested at the pin on actual components and may be checked at either the pin or the pad in
simulation. The AC and DC input specifications are relative to a VREF envelop that has been bandwidth limited to 200MHZ.
5. The value of V
IX
is expected to equal 0.5*V
DDQ
of the transmitting device and must track variations in the dc level of the same.
DDR SDRAM IDD spec table
(V
DD
=2.7V, T
= 10
°
C
)
AC Operating Conditions
Parameter/Condition
Symbol
Min
Max
Unit
Note
Input High (Logic 1) Voltage, DQ, DQS and DM signals
Input Low (Logic 0) Voltage, DQ, DQS and DM signals.
Input Differential Voltage, CK and CK inputs
Input Crossing Point Voltage, CK and CK inputs
VIH(AC)
VIL(AC)
VID(AC)
VIX(AC)
VREF + 0.31
V
V
V
V
3
3
1
2
VREF - 0.31
VDDQ+0.6
0.5*VDDQ+0.2
0.7
0.5*VDDQ-0.2
Note 1. VID is the magnitude of the difference between the input level on CK and the input on CK.
2. The value of V
IX
is expected to equal 0.5*V
DDQ
of the transmitting device and must track variations in the DC level of the same.
3. These parameters should be tested at the pim on actual components and may be checked at either the pin or the pad in simu
lation. the AC and DC input specificatims are refation to a Vref envelope that has been bandwidth limited 20MHz.
Parameter
Specification
Address &
Control pins
1.6 V
1.6 V
4.5 V-ns
4.5 V-ns
Data pins
Maximum peak amplitude allowed for overshoot
Maximum peak amplitude allowed for undershoot
The area between the overshoot signal and VDD must be less than or equal to
The area between the undershoot signal and GND must be less than or equal to
1.2V
1.2V
2.5 V-ns
2.5 V-ns
Overshoot/Undershoot specification
Symbol
16Mx16
Unit
Notes
K4H560838D-GC(L)B3
(DDR333)
90
125
3
25
20
35
55
200
190
180
3
1.5
350
K4H560838D-GC(L)A2, B0
(DDR266A/B)
80
115
3
20
18
30
45
170
155
165
3
1.5
300
IDD0
IDD1
IDD2P
IDD2F
IDD2Q
IDD3P
IDD3N
IDD4R
IDD4W
IDD5
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
IDD6
Normal
Low power
IDD7A
Optional
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| K4H560438E-ZLA2 | Rectangular Industrial Connector Housing; Series:C-146; No. of Contacts:6; Gender:Female; Body Material:Aluminum Alloy; Connecting Termination:Screw; Features:Spring Cover; For Use With:C146 Rectangular Circular Connectors RoHS Compliant: Yes |
| K4H560438E-ZCB0 | CSM, CER 103PF 1000V 10% 1210 |
| K4H560438E-ZCB3 | 256Mb E-die DDR SDRAM Specification 60 FBGA with Pb-Free (RoHS compliant) |
| K4H560438E-GLB0 | DIODE ZENER SINGLE 300mW 36.3Vz 5mA-Izt 0.02522 0.05uA-Ir 30 SOT-23 3K/REEL |
| K4H560438E-GLB3 | DIODE ZENER SINGLE 300mW 39.13Vz 5mA-Izt 0.02518 0.05uA-Ir 30 SOT-23 3K/REEL |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| K4H560438H | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:DDR SDRAM Product Guide |
| K4H560438H-UC/LA2 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:256Mb H-die DDR SDRAM Specification |
| K4H560438H-UC/LB0 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:256Mb H-die DDR SDRAM Specification |
| K4H560438J | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:256Mb J-die DDR SDRAM Specification |
| K4H560438J-LC/LB0 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:256Mb J-die DDR SDRAM Specification |
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