FN6912.1 April 15, 2010 ISL22317 Package Outline Drawing L10.3x3B 10 LEAD THIN DUAL FLAT PACKAGE (TDFN) WITH E-PAD Rev 2, 03/10 located " />
參數(shù)資料
型號(hào): ISL22317TFRTZ-TK
廠商: Intersil
文件頁(yè)數(shù): 7/15頁(yè)
文件大?。?/td> 0K
描述: IC POT DGTL 128TP LN LP 10-TDFN
產(chǎn)品培訓(xùn)模塊: Solutions for Industrial Control Applications
標(biāo)準(zhǔn)包裝: 1,000
系列: XDCP™
接片: 128
電阻(歐姆): 100k
電路數(shù): 1
溫度系數(shù): 標(biāo)準(zhǔn)值 ±10 ppm/°C
存儲(chǔ)器類型: 非易失
接口: I²C(設(shè)備位址)
電源電壓: 2.7 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 10-WFDFN 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝: 10-TDFN-EP(3x3)
包裝: 帶卷 (TR)
15
FN6912.1
April 15, 2010
ISL22317
Package Outline Drawing
L10.3x3B
10 LEAD THIN DUAL FLAT PACKAGE (TDFN) WITH E-PAD
Rev 2, 03/10
located within the zone indicated. The pin #1 identifier may be
Unless otherwise specified, tolerance : Decimal ± 0.05
Tiebar shown (if present) is a non-functional feature.
The configuration of the pin #1 identifier is optional, but must be
between 0.18mm and 0.30mm from the terminal tip.
Dimension applies to the metallized terminal and is measured
Dimensions in (
) for Reference Only.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
6.
either a mold or mark feature.
3.
5.
4.
2.
Dimensions are in millimeters.
1.
NOTES:
BOTTOM VIEW
DETAIL "X"
SIDE VIEW
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
(4X)
0.15
INDEX AREA
PIN 1
PIN #1 INDEX AREA
C
SEATING PLANE
0.08
SEE DETAIL "X"
C
C
5
6
A
B
0.10 C
2
6
10
1
PACKAGE
0.
75
0.05
0.
50
2.
38
+0.
1
/-
0.
15
3.0
0
(10X0.25)
(8x 0.50)
2.
3
8
1.64
(10x0.20)
(10x0.40)
3.00
0.05
0.20 REF
0.25 +0.05/ - 0.07
10x 0.40 +/- 0.1
1.64 +0.1/ -0.15
OUTLINE
4
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