31 FN6668.9 June 20, 2012 Package Outline Drawing M20.3 20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE (SOIC) Rev 3, 2/11 7. The lea" />
參數(shù)資料
型號: ISL12022MIBZ-T7A
廠商: Intersil
文件頁數(shù): 25/31頁
文件大小: 0K
描述: IC RTC/CALENDAR TEMP SNSR 20SOIC
應用說明: Addressing Power Issues in Real Time Clock Appls
產(chǎn)品培訓模塊: Solutions for Industrial Control Applications
標準包裝: 250
類型: 時鐘/日歷
特點: 警報器,夏令時,閏年,SRAM
存儲容量: 128B
時間格式: HH:MM:SS(12/24 小時)
數(shù)據(jù)格式: YY-MM-DD-dd
接口: I²C,2 線串口
電源電壓: 2.7 V ~ 5.5 V
電壓 - 電源,電池: 1.8 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 20-SOIC(0.295",7.50mm 寬)
供應商設備封裝: 20-SOIC
包裝: 帶卷 (TR)
ISL12022M
31
FN6668.9
June 20, 2012
Package Outline Drawing
M20.3
20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE (SOIC)
Rev 3, 2/11
7. The lead width as measured 0.36mm (0.14 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
DETAIL "X"
SIDE VIEW
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
13.00
0.75
0.25
x 45°
0.32
0.23
MAX
1.27
0.40
10.65
10.00
7.60
7.40
20
12
3
INDEX
AREA
2.65
2.35
0.30
MAX
BSC
1.27
0.35
0.49
0.25 (0.10) MC
S
B
M
A
0.10 (0.004)
0.25 (0.10) MB M
1
2
1.27 BSC
(9.40mm)
SEATING PLANE
(0.60)
(2.00)
2
20
3
5
7
NOTES:
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Dimension does not include mold flash, protrusions or gate
3. Dimension does not include interlead lash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
5. Dimension is the length of terminal for soldering to a substrate.
6. Terminal numbers are shown for reference only.
8. Controlling dimension: MILLIMETER.
9. Dimensions in ( ) for reference only.
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
(0.024 inch)
10. JEDEC reference drawing number: MS-013-AC.
12.60
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