參數(shù)資料
型號(hào): ISD5116
廠商: WINBOND ELECTRONICS CORP
英文描述: Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability
中文描述: 單芯片語(yǔ)音記錄/播放設(shè)備與數(shù)字存儲(chǔ)能力為16分鐘時(shí)間
文件頁(yè)數(shù): 37/57頁(yè)
文件大?。?/td> 735K
代理商: ISD5116
October 2000
Page 36
6.3 POWER AND GROUND PINS
V
CCA
, V
CCD
(Voltage Inputs)
To minimize noise, the analog and digital circuits in the ISD5116 device use separate power busses.
These +3 V busses lead to separate pins. Tie the V
CCD
pins together as close as possible and decouple
both supplies as near to the package as possible.
V
SSA
, V
SSD
(Ground Inputs)
The ISD5116 series utilizes separate analog and digital ground busses. The analog ground (V
SSA
) pins
should be tied together as close to the package as possible and connected through a low-impedance
path to power supply ground. The digital ground (V
SSD
) pin should be connected through a separate low
impedance path to power supply ground. These ground paths should be large enough to ensure that the
impedance between the V
SSA
pins and the V
SSD
pin is less than 3
. The backside of the die is connected
to V
SSD
through the substrate resistance. In a chip-on-board design, the die attach area must be con-
nected to V
SSD
.
NC (Not Connect)
These pins should not be connected to the board at any time. Connection of these pins to any signal,
ground or V
CC,
may result in incorrect device behavior or cause damage to the device.
6.4 SAMPLE PC LAYOUT
The SOIC package is illustrated from the top. PC board traces and the three chip capacitors are on the
bottom side of the board.
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
V
C
C
D
XCLK
Analog Ground
1
V
SSA
To
V
CCA
V
S
S
D
(Digital Ground)
Note 1: V
SSD
traces should be kept
separated back to the V
SS
supply feed
point..
Note 2: V
CCD
traces should be kept
separate back to the V
CC
Supply feed
point.
Note 3: The Digital and Analog grounds
tie together at the power supply. The
V
CCA
and V
CCD
supplies will also need
filter capacitors per good engineering
practice (typ. 50 to 100 uF).
C1
C2
C3
Note 1
Note 2
C1=C2=C3=0.1 uF chip Capacitors
Note 3
Note 3
相關(guān)PDF資料
PDF描述
ISD5116E Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability
ISD5116ED Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability
ISD5116EI Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability
ISD5116P Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability
ISD5116S Single-Chip Voice Record/Playback Device Up to 16-Minute Duration with Digital Storage Capability
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參數(shù)描述
ISD5116E 功能描述:IC VOICE REC/PLAY 8-16MN 28-TSOP RoHS:否 類別:集成電路 (IC) >> 接口 - 語(yǔ)音錄制和重放 系列:ISD5100 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時(shí)間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱:90-21300+000
ISD5116ED 功能描述:IC VOICE REC/PL 8-16MN EX 28TSOP RoHS:否 類別:集成電路 (IC) >> 接口 - 語(yǔ)音錄制和重放 系列:ISD5100 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時(shí)間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱:90-21300+000
ISD5116EDR 功能描述:IC VOICE REC/PL 8-16MN EX 28TSOP RoHS:否 類別:集成電路 (IC) >> 接口 - 語(yǔ)音錄制和重放 系列:ISD5100 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時(shí)間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱:90-21300+000
ISD5116EI 功能描述:IC VOICE REC/PL 8-16MN IN 28TSOP RoHS:否 類別:集成電路 (IC) >> 接口 - 語(yǔ)音錄制和重放 系列:ISD5100 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時(shí)間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱:90-21300+000
ISD5116EIR 功能描述:IC VOICE REC/PL 8-16MN IN 28TSOP RoHS:否 類別:集成電路 (IC) >> 接口 - 語(yǔ)音錄制和重放 系列:ISD5100 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時(shí)間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱:90-21300+000