參數(shù)資料
型號(hào): IDT79RC32H435-300BCI
廠商: IDT, Integrated Device Technology Inc
文件頁數(shù): 7/53頁
文件大?。?/td> 0K
描述: IC MPU 32BIT CORE 300MHZ 256-BGA
標(biāo)準(zhǔn)包裝: 90
系列: Interprise™
處理器類型: MIPS32 32-位
速度: 300MHz
電壓: 1.2V
安裝類型: 表面貼裝
封裝/外殼: 256-LBGA
供應(yīng)商設(shè)備封裝: 256-CABGA(17x17)
包裝: 托盤
其它名稱: 79RC32H435-300BCI
15 of 53
January 19, 2006
IDT 79RC32435
AC Timing Definitions
Below are examples of the AC timing characteristics used throughout this document.
Figure 2 AC Timing Definitions Waveform
Symbol
Definition
Tper
Clock period.
Tlow
Clock low. Amount of time the clock is low in one clock period.
Thigh
Clock high. Amount of time the clock is high in one clock period.
Trise
Rise time. Low to high transition time.
Tfall
Fall time. High to low transition time.
Tjitter
Jitter. Amount of time the reference clock (or signal) edge can vary on either the rising or falling edges.
Tdo
Data out. Amount of time after the reference clock edge that the output will become valid. The minimum time represents the data output hold.
The maximum time represents the earliest time the designer can use the data.
Tzd
Z state to data valid. Amount of time after the reference clock edge that the tri-stated output takes to become valid.
Tdz
Data valid to Z state. Amount of time after the reference clock edge that the valid output takes to become tri-stated.
Tsu
Input set-up. Amount of time before the reference clock edge that the input must be valid.
Thld
Input hold. Amount of time after the reference clock edge that the input must remain valid.
Tpw
Pulse width. Amount of time the input or output is active for asynchronous signals.
Tslew
Slew rate. The rise or fall rate for a signal to go from a high to low, or low to high.
X(clock)
Timing value. This notation represents a value of ‘X’ multiplied by the clock time period of the specified clock. Using 5(CLK) as an example:
X = 5 and the oscillator clock (CLK) = 25MHz, then the timing value is 200.
Tskew
Skew. The amount of time two signal edges deviate from one another.
Table 4 AC Timing Definitions
Tdz
Tzd
Tdo
Tpw
Thld
Tsu
Tlow
Thigh
Tper
clock
Output signal 1
Output signal 2
Input Signal 1
Signal 1
Tjitter
Trise
Tfall
Tdo
Signal 2
Signal 3
Tskew
相關(guān)PDF資料
PDF描述
IDT71V67803S133BG IC SRAM 9MBIT 133MHZ 119BGA
IDT71V67703S85BG IC SRAM 9MBIT 85NS 119BGA
IDT71V67703S80BG IC SRAM 9MBIT 80NS 119BGA
AMM40DTBH-S189 CONN EDGECARD 80POS R/A .156 SLD
AMM40DTBD-S189 CONN EDGECARD 80POS R/A .156 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IDT79RC32H435-350BC 功能描述:IC MPU 32BIT CORE 350MHZ 256-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:Interprise™ 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類型:32-位 MPC83xx PowerQUICC II Pro 特點(diǎn):- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤 供應(yīng)商設(shè)備封裝:516-PBGAPGE(27x27) 包裝:托盤
IDT79RC32H435-350BCG 功能描述:IC MPU 32BIT CORE 350MHZ 256-BGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:Interprise™ 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類型:32-位 MPC83xx PowerQUICC II Pro 特點(diǎn):- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤 供應(yīng)商設(shè)備封裝:516-PBGAPGE(27x27) 包裝:托盤
IDT79RC32H435-350BCGI 功能描述:IC MPU 32BIT CORE 350MHZ 256-BGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:Interprise™ 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類型:32-位 MPC83xx PowerQUICC II Pro 特點(diǎn):- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤 供應(yīng)商設(shè)備封裝:516-PBGAPGE(27x27) 包裝:托盤
IDT79RC32H435-350BCI 功能描述:IC MPU 32BIT CORE 350MHZ 256-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:Interprise™ 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類型:32-位 MPC83xx PowerQUICC II Pro 特點(diǎn):- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤 供應(yīng)商設(shè)備封裝:516-PBGAPGE(27x27) 包裝:托盤
IDT79RC32H435-400BC 功能描述:IC MPU 32BIT CORE 400MHZ 256-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:Interprise™ 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類型:32-位 MPC83xx PowerQUICC II Pro 特點(diǎn):- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤 供應(yīng)商設(shè)備封裝:516-PBGAPGE(27x27) 包裝:托盤