參數(shù)資料
型號: ICS853S006AGILF
廠商: IDT, Integrated Device Technology Inc
文件頁數(shù): 7/19頁
文件大小: 0K
描述: IC CLOCK BUFFER 1:6 2GHZ 20TSSOP
特色產(chǎn)品: IDT - ?LVPECL Buffer
標(biāo)準(zhǔn)包裝: 74
系列: HiPerClockS™
類型: 扇出緩沖器(分配)
電路數(shù): 1
比率 - 輸入:輸出: 1:6
差分 - 輸入:輸出: 是/是
輸入: CML,LVDS,LVPECL,SSTL
輸出: ECL,PECL
頻率 - 最大: 2GHz
電源電壓: 2.375 V ~ 3.465 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 20-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 20-TSSOP
包裝: 管件
其它名稱: 800-2247
ICS853S006I Data Sheet
LOW SKEW, 1-TO-6, DIFFERENTIAL-TO-2.5V, 3.3V LVPECL/ECL FANOUT BUFFER
ICS853S006AGI REVISION A NOVEMBER 15, 2011
15
2011 Integrated Device Technology, Inc.
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS853S006I.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS853S006I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 60mA = 207.9mW
Power (outputs)MAX = 32.02mW
If all outputs are loaded, the total power is 6 * 32.02mW = 192.12mW
Total Power_MAX (3.465V, with all outputs switching) = 207.9mW + 192.12mW = 400.02mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The
maximum recommended junction temperature for this device is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C
ensures that the bond wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 92.1°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.400W * 92.1°C/W = 121.84°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 6. Thermal Resistance θJA for 20 Lead TSSOP, Forced Convection
θ
JA by Velocity
Meters per Second
01
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
92.1°C/W
86.5°C/W
83.0°C/W
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