
0.85
—
HYB18T256324F–[16/20/22]
256-Mbit DDR SGRAM
Electrical Characteristics
Data Sheet
75
Rev. 1.11, 04-2005
10292004-DOXT-FS0U
4.13
Summary of timing parameters for –1.6, –2.0 and –2.2 ns speed sorts in DLL
on mode
Table 43
Parameter
Timing Parameters for –1.6, –2.0 and –2.2 speed sorts
Read
latency
bol
Sym-
Limit Values
–1.6
min
Unit
Notes
–2.0
max
–2.2
max
max
min
min
Clock and Clock Enable
Clock Cycle Time
7
6
5
7
6
5
t
CK7
t
CK6
t
CK5
f
CK7
f
CK6
f
CK5
t
CH
t
CL
t
HP
1.6
2.0
—
300
300
—
0.45
0.45
0.45
3.3
3.3
—
600
500
—
0.55
0.55
—
2.0
2.0
—
250
250
—
0.45
0.45
0.45
4.0
4.0
—
500
500
—
0.55
0.55
—
2.2
2.2
2.7
250
250
250
0.45
0.45
0.45
4.0
4.0
4.0
455
455
370
0.55
0.55
—
ns
ns
ns
MHz
MHz
MHz
t
CK
t
CK
t
CK
System frequency
Clock high level width
Clock low-level width
Minimum clock half period
Command and Address Setup and Hold Timing
Address/Command input setup time
t
IS
Address/Command input hold time
Address/Command input pulse
width
Mode Register Set Timing
Mode Register Set cycle time
Mode Register Set to READ timing
t
MRDR
Row Timing
Row Cycle Time
Row Active Time
ACT(a) to ACT(b) Command period
t
RRD
Row Precharge Time
Row to Column Delay Time for
Reads
Row to Column Delay Time for
Writes
Column Timing
CAS(a) to CAS(b) Command period
t
CCD
Write to Read Command Delay
Read to Write command delay
Write Cycle Timing Parameters for Data and Data Strobe
Write command to first WDQS
latching transition
Data-in and Data Mask to WDQS
Setup Time
1)
0.6
0.6
—
—
0.75
0.75
0.85
—
—
—
0.75
0.75
0.85
—
—
—
ns
ns
t
CK
t
IH
t
IPW
t
MRD
5
15
—
—
4
12
—
—
4
12
—
—
t
CK
t
CK
t
RC
t
RAS
37.2
24.0
8.0
13.2
—
8 x t
REFI
—
—
—
37.2
24.0
8.0
13.2
16.0
—
8 x t
REFI
26.2
—
–
–
39.6
—
8 x t
REFI
ns
—
–
–
ns
8.8
13.2
17.5
ns
ns
ns
t
RP
t
RCDRD
16.0
t
RCDWR
t
RCDWR(min)
=
t
RCDRD(min)
- (WL + 1) x
t
CK(min)
ns
2
6.0
—
—
2
6.0
—
—
2
6.6
—
—
t
CK
ns
t
CK
2)
t
WTR
t
RTW
3)
t
RTW
(min)= (CL+4-WL)
4)
t
DQSS
WL -
0.25
0.35
WL
+0.25
—
WL -
0.25
0.375
WL
+0.25
—
WL -
0.25
0.375
WL
+0.25
—
t
CK
t
DS
ns