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參數(shù)資料
| 型號： | HT2MOA3S20 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | HITAGTM2 Chip Module |
| 中文描述： | HITAGTM2芯片模塊 |
| 文件頁數(shù)： | 3/22頁 |
| 文件大?。?/td> | 161K |
| 代理商： | HT2MOA3S20 |
Specifications of the HT2 MOA3 S20
Rev. 1.1
1997-08-19
Ht2moa3.doc/HS
Page 3 of 22
1 Definitions
1.1 Objective of the Specifications
This specification lists the parameters to be fulfilled by the HITAG 2 chip module
HT2 MOA3 S20 for contactless smart cards or similar transponders (as e.g. discs).
1.2 Definition of the Chip Module
A chip module is an electronically packaged chip covered with a globe top cap. The
HT2 MOA3 S20 is above all used as card module, i.e. for further lamination into contactless
smart cards according to ISO 10536.1.
So the HITAG 2 chip module HT2 MOA3 S20 is best suited for customers that do not want to
spend time with micro assembly and therefore start - e.g. ISO card production - with the
HITAG 2 chip module.
1.3 Use of the Modules
The HITAG 2 modules are designed to be connected to a coil and then to be further processed by
packaging into a transponder (e.g. lamination into an ISO smart card). Specific processing
information for the coil-module connection and packaging is given in the specification.
For production of contactless chip cards it is recommended to prepunch card foils to create a
recess for the chip module in the card body.
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相關代理商/技術參數(shù) |
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| HT2MOA3S20/E/1 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:HITAGTM2 Chip Module |
| HT2MOA3S20/E/3 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:HITAGTM2 Chip Module |
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