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參數(shù)資料
| 型號： | HT2MOA3S20 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | HITAGTM2 Chip Module |
| 中文描述： | HITAGTM2芯片模塊 |
| 文件頁數(shù)： | 18/22頁 |
| 文件大?。?/td> | 161K |
| 代理商： | HT2MOA3S20 |
Specifications of the HT2 MOA3 S20
Rev. 1.1
1997-08-19
Ht2moa3.doc/HS
Page 18 of 22
6 Quality Inspection
Quality inspection is performed with statistical quality control according to ISO 2859 part 1, with
AQL1.0.
Optical Properties
scratches,
encapsulation failures,
gold discolouration,
delamination
according to the reference sample
catalogue
Geometrical Properies width
measured with gauge
length
measured with gauge
overall thickness
measured with micrometer at the center of
the transfer mould cap
Electrical Properties
operation
basic read/write operations
Shipment Quantity
Packing and Labeling
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| HT2MOA3S20/E/1 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:HITAGTM2 Chip Module |
| HT2MOA3S20/E/3 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:HITAGTM2 Chip Module |
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